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Redmi K30 Ultra teardown reveals the scale of the copper vapour chamber cooling system in Xiaomi's latest smartphone

The Redmi K30 Ultra is one of the first smartphones to feature MediaTek's Dimensity 1000+ chipset. (Image source: Xiaomi)
The Redmi K30 Ultra is one of the first smartphones to feature MediaTek's Dimensity 1000+ chipset. (Image source: Xiaomi)
The Redmi K30 Ultra has been torn down, revealing the complex interior of Xiaomi's Dimensity 1000+ powered smartphone. The teardown confirms the device's large vapour chamber cooling system, which measures almost 3,500 mm².

The Redmi K30 Ultra has received its first teardown, albeit not from Xiaomi or JerryRigEverything. Instead, the Dimensity 1000+ powered device has been stripped apart by Tech inventions, which has published a disassembly video on YouTube. The video lacks enough detail to be used as a guide for repairing the new smartphone, but it does offer a glimpse of how Xiaomi has put the device together.

The internal of the Redmi K30 Ultra are accessed by removing its glass back panel, as is the case with most modern smartphones. Beneath that lies a plastic mid-frame, which Xiaomi has secured with several screws. Removing that reveals the magic of the device's pop-up front-facing camera, which attaches to the chassis via a single screw. The Redmi K30 Ultra also has four rear-facing cameras, of which three are housed in the same metal frame.

Additionally, Xiaomi has included a huge copper vapor chamber cooling system inside the device. According to Tech inventions, the Redmi K30 Ultra has 3,495 mm² of copper, which wicks away heat from the device's powerful SoC. Overall, the Redmi K30 Ultra is built rather differently than the Mi 10 Ultra. The cooling system is more pronounced on the former, for example, but the latter has visibly larger camera sensors. Xiaomi managed to squeeze 4,500 mAh batteries into both devices though, which should prove popular with fans.

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> Notebook / Laptop Reviews and News > News > News Archive > Newsarchive 2020 08 > Redmi K30 Ultra teardown reveals the scale of the copper vapour chamber cooling system in Xiaomi's latest smartphone
Alex Alderson, 2020-08-18 (Update: 2020-08-18)
Alex Alderson
Alex Alderson - News Editor - @aldersonaj
Prior to writing and translating for Notebookcheck, I worked for various companies including Apple and Neowin. I have a BA in International History and Politics from the University of Leeds, which I have since converted to a Law Degree. Happy to chat on Twitter or Notebookchat.