Dimensity 1000+ vs Snapdragon 865 vs Kirin 990 5G: MediaTek's SoC demonstrates itself as a price-performance powerhouse in the Redmi K30 Ultra

“MediaTek” might be a dirty word to some, but it’s hard to deny that the new Dimensity range of mobile chips is outstanding. This has been further proved through a battery of tests that compared the Dimensity 1000+ in the Redmi K30 Ultra with a Qualcomm Snapdragon 865 and HiSilicon Kirin 990 5G in unspecified devices. The Redmi smartphone can certainly be classed as an affordable device, and the benchmark results show how well the MediaTek chip held up against rivals that were undoubtedly inside much more expensive smartphones.

The three SoCs were tested in AnTuTu (v8.4.3), Geekbench 5.0, 3DMark, and GFXBench (results can be seen in the charts below). The MediaTek Dimensity 1000+ surpassed the Kirin 990 5G in every test but one: The multi-core result in Geekbench 5.0 slightly favored the HiSilicon chip – 3,213 points vs. 3,100 points. It needs to be recorded here that the Kirin 990 5G can be found in high-end premium devices like the Huawei P40 series and the very-expensive Huawei Mate Xs foldable. These are smartphones that go over US$1,000 (especially the Mate Xs), whereas the Redmi K30 Ultra costs the equivalent of around US$300-400.

Moving on to the Dimensity 1000+ vs. Snapdragon 865 contest, the MediaTek chip once again manages to keep up with the costlier rival. The Qualcomm processor comes out top in every single test, but the cheaper Dimensity 1000+ is never too far behind, especially in the four GFXBench tests. Yet again, it needs to be mentioned that the SD 865 crops up in pricey smartphones such as the Xiaomi Mi 10 and OnePlus 8. If the Redmi K30 Ultra does get a global release, its combination with the price-performance powerhouse MediaTek Dimensity 1000+ could really shake things up in the sub-US$400 segment of the smartphone market.