Dimensity 2000: early leaks point to a 2021 launch and "significant" gains for the second-gen MediaTek flagship SoC series
A recent report from the leak-rich blog MyDrivers asserts that MediaTek intends to launch its next-gen flagship SoC in 2Q2021. It will allegedly go under the name Dimensity 2000, thus keeping the company's still-fresh motif going. This chipset is also now touted to be composed of at least some ARM Cortex-A78 cores and an upgraded Mali GPU.
Should this prove true, it may indeed be capable of rivalling Qualcomm's Snapdragon 875 in 2021. Furthermore, the Dimensity 2000 is now projected to be made using a 5-nanometer (nm) process, whereas its predecessor is 7nm. This could indeed confer significant improvements in terms of performance and efficiency over anything currently available in 2020.
That is not the only potential headache this putative 2000 and its possible next-gen Dimensity siblings could inflict on competitors such as Samsung: MediaTek is also now rumored to become the primary chip-supplier to Huawei, in lieu of this company's usual own-brand line of Kirin SoCs.
The Chinese electronics giant may have lost the ability to procure them, as TSMC has recently announced it is no longer in a position to fabricate or ship these custom-made mobile CPUs. A future of more Huawei phones powered by MediaTek silicon is plausible: the OEM has conducted multiple launches of Dimensity 800-based devices already, after all.
On the subject of such sub-flagship chipsets, MyDrivers also now claims their maker will add at least one more to their number before the end of the year. This variant, the 400, is thought to usher in the era of the truly budget 5G phone. This may be the final domino in the process of this new mobile data standard's uptake.