Redmi K30 Pro: Teardown video confirms stacked motherboard, dual-OIS, in-screen fingerprint scanner and huge vapour chamber cooling system ahead of March 24 launch

Xiaomi and its subsidiary Redmi have revealed plenty of details about the Redmi K30 Pro over the last few days. Due to be showcased tomorrow, the Redmi K30 Pro will feature a Snapdragon 865 SoC and a design reminiscent of the Redmi K20 Pro. Possible pricing details for the upcoming device and the Redmi K30 Pro Zoom have appeared online too, as we reported yesterday.

The Redmi Weibo channel has also offered a look at the internals of the Redmi K30 Pro. The photo, which we have included above, shows off the device's pop-up camera mechanism, along with its motherboard and rear-facing cameras. According to the company, the Redmi K30 Pro will feature dual-OIS and a stacked motherboard. The latter has become increasingly common in smartphone design over the last few years as OEMs try to maximise the available space for more hardware and larger batteries.

These two elements have been confirmed in a video published by YouTube channel CREATOR STUDIO. Included below, the channel demonstrates that the IMX686 and telephoto camera are optically stabilised. The video also discusses the device's stacked motherboard, along with its huge vapour chamber cooling system and its in-screen fingerprint scanner.

Overall, Xiaomi appears to have packed the Redmi K30 Pro full of impressive hardware. If the rumoured pricing for the series proves accurate, then the Redmi K30 Pro and the K30 Pro Zoom will be an enticing prospect for 2020.