Though soon debunked, a major concern with the original PlayStation 5 was the possibility of the liquid metal thermal interface material (TIM) leaking if the console is placed vertically. However, ensuing issues of dry spots developing due to either contaminations with the adhesive in the foam seal or due to oxidation issues with the liquid metal itself aren't unheard of.
Looks like the new PS5 Pro alleviates these problems thanks to a grooved heatsink design. Steve Porter from TronicsFix posted a teardown of the PS5 Pro on YouTube that shows the console fitted with a new heatsink.
While not exactly a widespread problem, many older vertically placed PS5s developed oxidation spots due to the liquid metal sinking to the bottom of the die. This would necessitate disassembling the console, removing the oxidation spot, and respreading the liquid metal to restore optimal thermal performance.
With the PS5 Pro, Sony is implementing a new heatsink with machined grooves that should potentially retain the liquid metal in place, preventing it from sinking or spilling out. Steve notes that these grooves also increase the surface area, which should theoretically help with better heat transfer and cooling. He observes that there is some liquid metal outside the grooved area as well, but the majority of the TIM is within the grooves.
To see if the grooved heatsink is actually keeping the liquid metal in place, Steve dropped the PS5 Pro several times from a few inches above the desk before disassembling it again. On inspection, the grooves indeed seem to prevent the liquid metal from spilling.
However, this is not exactly a scientific test and only time will tell if PS5 Pro owners observe oxidation or liquid metal sinking issues.
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