While the MediaTek Dimensity 9000 received plaudits at launch for outperforming the Snapdragon 8 Gen 1, the Dimensity 8100 has attained greater appeal for its strong, Snapdragon 888-rivaling performance and even better efficiency. MediaTek looks set to build on that success, as word of a direct successor has now surfaced for the first time.
As revealed by Chinese leaker Digital Chat Station, MediaTek is already working on a proper successor to the current Dimensity 8000-series chipsets, the Dimensity 8000 and Dimensity 8100. Supposedly, the new chipset, potentially branded as the Dimensity 8200, is tentatively scheduled to debut at the end of the year. The Dimensity 8000 and 8100 launched in March, so a planned release for the next-gen chipset this year would be ahead of schedule.
Digital Chat Station claims the next-gen SoC's "parameters are very, very good-looking", which should excite admirers of the already impressive Dimensity 8100. The Dimensity 8100, for example, has been put through gaming tests and come out on top versus chipsets like the Snapdragon 8 Gen 1 and Apple M1 on the iPad Air 5. The leaker has also claimed the new chipset will be built on TSMC's 4nm node, the same node on which the Snapdragon 8+ Gen 1 and Dimensity 9000 are built. That should guarantee improved efficiency.
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