Early Snapdragon 7 Gen 2 and MediaTek Dimensity 8200 details surface in new leak

The MediaTek Dimensity 8100 appears to be seeing even more success than the more premium Dimensity 9000, thanks to its lower price, class-leading efficiency, and Snapdragon 888-rivaling performance. The Snapdragon 7 Gen 1 was originally assumed to be a worthy competitor but ended up disappointing. Instead, Qualcomm already has its sights set on a successor.

According to leaker Digital Chat Station, Qualcomm is working on a successor to the lackluster Snapdragon 7 Gen 1. This chipset, which could be the Snapdragon 7+ Gen 1 or more likely the Snapdragon 7 Gen 2, will give up Samsung's 4 nm node for TSMC's alternative—essentially mirroring Qualcomm's decision with the Snapdragon 8+ Gen 1. Specifically, the Qualcomm sub-premium chipset will be akin to a Snapdragon 8+ Gen 1 Lite. The Dimensity 8200, similarly, is reported to borrow some features from the Dimensity 9000.

The leaker goes on to claim that several devices which will feature either the TSMC-made Snapdragon 7 series chipset or the Dimensity 8100's successor, are already in the works. Said devices will arrive with high refresh rate displays, 100 W fast charging, and 50 MP main cameras. It's unknown when the Qualcomm chipset will debut but there's a chance it launches alongside the Snapdragon 8 Gen 2 in November. The Dimensity 8100's successor is tipped to debut at the end of the year as well.

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