HiSilicon Kirin 970 vs Qualcomm Snapdragon 860 vs MediaTek Dimensity 800U

HiSilicon Kirin 970

The HiSilicon Kirin 970 is an ARM based high-end octa-core SoC for smartphones and tablet, which was introduced with the Huawei Mate 10 in late 2017. Besides 8 CPU cores (4x Cortex-A73, 4x Cortex-A53), the SoC is also equipped with a modern Mali-G72 MP12 graphics adapter, a dual-channel LPDDR4 memory controller as well as an LTE (4x4 MIMO, 5-band-carrier-aggregation, QAM-256, up to 1.2 Gbit/s) modem.

The performance cluster is clocked at up to 2.4 GHz and the four A53 power saving cores with up to 1.8 GHz. The performance should improve by about 20 percent according to Huawei and the power consumption reduced by 20 percent.

On the chip HiSilicon also included a dedicated Neural Processing Unit (NPU) for running machine learning tasks very efficiently compared to the CPU cores.

Qualcomm Snapdragon 860

The Qualcomm Snapdragon 860 (SM8150-AC) Mobile Platform is a high-end smartphone and tablet SoC that Qualcomm announced in 2021. Compared to the old Snapdragon 855 Plus, the 860 is very similar and adds support for 16 GB RAM and a few camera features.

The SoC integrates a fast ‘Prime Core’ that clocks up to 2.96 GHz (up from 2.84 GHz in the 855) and three further fast ARM Cortex-A76 performance cores, which can reach up to 2.42 GHz. These are complemented by four power-saving ARM Cortex-A55 cores that clock up to a maximum of 1.8 GHz.

The SoC also integrates the X24 LTE modem that Qualcomm promises will deliver up to 2 Gbit/s maximum download speed over LTE Cat.20 and up to 316 Mbit/s upload speeds. The Snapdragon 860 can be configured with the company’s new X50 5G modem too (as an external chip).

The integrated Wi-Fi modem, which is Wi-Fi 6-ready, has 8x8 Sounding and supports up to 802.11 ay Wi-Fi. The Wi-Fi modem can utilise the 60 GHz mmWave band for up to 10 Gbit/s internet speeds.

The Hexagon 690 DSP incorporates a neural processing unit (NPU) with dedicated Tensor-cores that can execute up to 7 trillion operations per second in conjunction with the CPU and GPU. In short, the Snapdragon 860 should be three times faster than the Snapdragon 845 and two times faster than the Kirin 980 SoC.

The Snapdragon 860 also has a Spectra 380 ISP onboard, which was the world’s first part to incorporate a Computer Vision Engine (CV-ISP) that can perform depth calculations in videos at up to 60 FPS. The Snapdragon 860 should deliver real-time portrait modes or be able to detect objects with relatively low power consumption.

The built-in memory controller supports up to 16 GB LPDDR4x RAM (4 x 16-bit). As the SD855 and 855+, the 860 integrates an Adreno 640 graphics card.

Qualcomm will manufacturer the Snapdragon 860 at the Taiwan Semiconductor Manufacturing Company (TSMC) using a 7 nm FinFET process. 

MediaTek Dimensity 800U

The Mediatek Dimensity 800U is a fast mid-range SoC with an integrated 5G modem. It includes two fast ARM Cortex-A76 cores at up to 2.4 GHz and six power efficient Cortex-A55 cores at up to 2 GHz (Octa-Core with Heterogeneous Multi-Processing). Furthermore, the chip integrates a 3 core ARM Mali-G57 MC3 GPU, a Wi-fi 5 modem, a LPDDR4x memory controller, a AI processing unit (APU 3.0) and video de- and encoding.

Compared to the Dimensity 820, the 800U offers lower clocked A76 cores and a slower GPU.

The Dimensity 800U is manufactured in the modern 7nm process and should be very power efficient.