HiSilicon Kirin 710 vs Qualcomm Snapdragon 450

HiSilicon Kirin 710

The HiSilicon Kirin 710 is a ARM-based mid-range Octa-Core-SoC for Android based smartphones and tablets. It was announced mid 2018 and contains 8 processor cores (4x Cortex-A73 at up to 2.2 GHz, 4x Cortex-A53 at up to 1.7 GHz, BigLITTLE), an ARM Mali G51 MP4, a dual-channel LPDDR4 memory controller and a LTE radio (600 Mbps down, 150 Mbps up). Therefore, the CPU part is similar to the Kirin 960 and 970 (both higher clocked), but the graphics card is a lot slower. 

The Kirin 710 is manufactured at TSMC in 12 nm (compared to the 16nm Kirin 960 and 10nm Kirin 970).

The HiSilicon Kirin 710F is the same chip with a different package (FCCSP - Flip Chip Chip Scale Package) and offers the same specifications (see e.g. our review of the Huawei P Smart Z).

Qualcomm Snapdragon 450

The Qualcomm Snapdragon 450 (SD450) is a lower mainstream SoC for (Android based) smartphones and tablets. It features eight ARM Cortex-A53 cores at up to 1.8 GHz and is already manufactured in the power efficient 14nm process. The integrated X9 LTE modem supports Cat. 7 with maximum transfer rates of 300 Mbps (downstream) and 150 Mbps (upstream). The SoC also includes an Adreno 506 GPU with support for Vulkan and OpenGL ES 3.1. WiFi 802.11ac (1x1, max 364 Mbps) and Bluetooth 4.1 are supported as well. The memory controller supports LPDDR3 (single channel) and the integrated video engine supports H.264 (encode and decode) and HEVC (only decode) in 1080p.