HiSilicon Kirin 710 vs Qualcomm Snapdragon 450 vs Qualcomm Snapdragon 616 MSM8939v2

HiSilicon Kirin 710

The HiSilicon Kirin 710 is a ARM-based mid-range Octa-Core-SoC for Android based smartphones and tablets. It was announced mid 2018 and contains 8 processor cores (4x Cortex-A73 at up to 2.2 GHz, 4x Cortex-A53 at up to 1.7 GHz, BigLITTLE), an ARM Mali G51 MP4, a dual-channel LPDDR4 memory controller and a LTE radio (600 Mbps down, 150 Mbps up). Therefore, the CPU part is similar to the Kirin 960 and 970 (both higher clocked), but the graphics card is a lot slower. 

The Kirin 710 is manufactured at TSMC in 12 nm (compared to the 16nm Kirin 960 and 10nm Kirin 970).

The HiSilicon Kirin 710F is the same chip with a different package (FCCSP - Flip Chip Chip Scale Package) and offers the same specifications (see e.g. our review of the Huawei P Smart Z).

Qualcomm Snapdragon 450

The Qualcomm Snapdragon 450 (SD450) is a lower mainstream SoC for (Android based) smartphones and tablets. It features eight ARM Cortex-A53 cores at up to 1.8 GHz and is already manufactured in the power efficient 14nm process. The integrated X9 LTE modem supports Cat. 7 with maximum transfer rates of 300 Mbps (downstream) and 150 Mbps (upstream). The SoC also includes an Adreno 506 GPU with support for Vulkan and OpenGL ES 3.1. WiFi 802.11ac (1x1, max 364 Mbps) and Bluetooth 4.1 are supported as well. The memory controller supports LPDDR3 (single channel) and the integrated video engine supports H.264 (encode and decode) and HEVC (only decode) in 1080p.

Qualcomm Snapdragon 616 MSM8939v2

The Qualcomm Snapdragon 616 MSM8939v2 is a mid-range ARMv8-based SoC largely for Android tablets and smartphones. Announced in February 2014, the S616 is one of the first 64-bit capable SoCs from Qualcomm. In addition to 8 Cortex-A53 CPU cores at up to 1.7 GHz (power saving cluster max. 1.2 GHz), the SoC integrates an Adreno 405 GPU with a 2x 32-bit memory controller (LPDDR3-1600, 12.8 GB/s) and supports Wi-Fi (802.11ac), Bluetooth 4.0, UMTS, and LTE.

CPU

The Cortex-A53 is the successor to the very popular Cortex-A7 design. In addition to the new 64-bit capable ARMv8 ISA, the cores offer a variety of other improvements such as better branch prediction. This leads to a significantly higher performance per clock, which is even above the older Cortex-A9.

The eight cores of the Snapdragon 616 are divided into two quad-core clusters, each optimized for a different operating point. While one cluster can clock up to 1.7 GHz to handle more demanding applications, the other cluster is limited to a maximum of 1.2 GHz for energy-saving purposes. All eight cores can be active at the same time, although most applications aren't parallelized to support 8 cores efficiently.

Overall, the Snapdragon 615 offers a performance similar to that of the older Snapdragon 600 (Krait architecture).

GPU

Another new feature is the integrated graphics unit named Adreno 405 (550 MHz most likely). The Adreno 400 series has been substantially redesigned and supports DirectX 11.2 (FL 11_1) including hardware tessellation, OpenGL ES 3.1, and OpenCL 1.2. Furthermore, the performance has been significantly improved, which is now similar to the Adreno 320 and PowerVR G6200.

Features

The Snapdragon 616 offers numerous wireless technologies such as Bluetooth 4.0 and WLAN 802.11a/b/g/n/ac as well as a Multi-SIM cellular modem supporting LTE cat. 4 (up to 150 Mbps), WCDMA, CDMA, EV-DO, TD-SCDMA and GSM/EDGE.

The SoC can encode and decode 1080p videos using dedicated hardware and stream content to displays with up to 2560 x 2048 pixels. A large number of video codecs including H.265 (playback only) will be supported. The camera ISP can handle sensors with up to 21 MP.

Power Consumption

The Snapdragon 616 is manufactured by TSMC in a 28 nm LP process. According to the specifications, we expect a medium or medium-high power consumption for use in medium-sized or larger smartphones and tablets.