HiSilicon Kirin 710 vs Qualcomm Snapdragon 625 vs Qualcomm Snapdragon 617 MSM8952

HiSilicon Kirin 710

The HiSilicon Kirin 710 is a ARM-based mid-range Octa-Core-SoC for Android based smartphones and tablets. It was announced mid 2018 and contains 8 processor cores (4x Cortex-A73 at up to 2.2 GHz, 4x Cortex-A53 at up to 1.7 GHz, BigLITTLE), an ARM Mali G51 MP4, a dual-channel LPDDR4 memory controller and a LTE radio (600 Mbps down, 150 Mbps up). Therefore, the CPU part is similar to the Kirin 960 and 970 (both higher clocked), but the graphics card is a lot slower. 

The Kirin 710 is manufactured at TSMC in 12 nm (compared to the 16nm Kirin 960 and 10nm Kirin 970).

The HiSilicon Kirin 710F is the same chip with a different package (FCCSP - Flip Chip Chip Scale Package) and offers the same specifications (see e.g. our review of the Huawei P Smart Z).

Qualcomm Snapdragon 625

The Qualcomm Snapdragon 625 (SD625) is a mid-range octa-core SoC with eight ARM Cortex-A53 cpu cores at up to 2 GHz, an Adreno 506 GPU, a DDR3L-1866 memory controller and a X9 LTE (Cat 7, 4G+, 300 Mbps down, 150 Mbps up) modem. Furthermore, the chip supports 802.11ac WiFi and Bluetooth 4.1. It is manufactured in 14nm FinFet. The processor performance should be similar to a HiSilicon Kirin 650, which also offers 8 Cortex A53 cores at up to 2 GHz. However, due to the modern manufacturing process, power consumption and throttling should be better with the Snapdragon 625.

Qualcomm Snapdragon 617 MSM8952

The Qualcomm Snapdragon 617 MSM8952 is a mid-range ARMv8-based SoC largely for Android tablets and smartphones announced in September 2015. In addition to 8 Cortex-A53 CPU cores at up to 1.5 / 1.2 (performance and power saving cluster) GHz, the SoC integrates an Adreno 405 GPU with a LPDDR3-1866 memory controller and supports Wi-Fi (802.11ac), Bluetooth 4.0, UMTS, and LTE. Compared to the older Snapdragon 615, the clock speeds are a bit lower (hits 1.7 GHz max).

CPU

The Cortex-A53 is the successor to the very popular Cortex-A7 design. In addition to the new 64-bit capable ARMv8 ISA, the cores offer a variety of other improvements such as better branch prediction. This leads to a significantly higher performance per clock, which is even above the older Cortex-A9.

The eight cores of the Snapdragon 617 are divided into two quad-core clusters, each optimized for a different operating point. While one cluster can clock up to 1.5 GHz to handle more demanding applications, the other cluster is limited to a maximum of 1.2 GHz for energy-saving purposes. All eight cores can be active at the same time, although most applications aren't parallelized to support 8 cores efficiently.

Overall, the Snapdragon 617 offers a performance similar to that of the older Snapdragon 600 (Krait architecture).

GPU

Another new feature is the integrated graphics unit named Adreno 405 (most likely around 550 MHz). The Adreno 400 series has been substantially redesigned and supports DirectX 11.2 (FL 11_1) including hardware tessellation, OpenGL ES 3.1, and OpenCL 1.2. Furthermore, the performance has been significantly improved, which is now similar to the Adreno 320 and PowerVR G6200.

Features

The Snapdragon 617 offers numerous wireless technologies such as Bluetooth 4.0 and WLAN 802.11a/b/g/n/ac as well as a Multi-SIM cellular modem supporting LTE cat. 4 (up to 150 Mbps), WCDMA, CDMA, EV-DO, TD-SCDMA and GSM/EDGE.

The SoC can encode and decode 1080p videos using dedicated hardware and stream content to displays with up to 2560 x 2048 pixels. A large number of video codecs including H.265 (playback only) will be supported. The camera ISP can handle sensors with up to 21 MP.

Power Consumption

The Snapdragon 617 is manufactured by TSMC in a 28 nm LP process. According to the specifications, we expect a medium or medium-high power consumption for use in medium-sized or larger smartphones and tablets.