Mediatek Helio G99 vs MediaTek Dimensity 810 vs MediaTek Dimensity 700
Mediatek Helio G99
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The Mediatek Helio G99 is a mainstream ARM SoC for smartphones (mainly Android based) that was introduced in 2022. It is manufactured in a 6 nm FinFET process and is equipped with 2x big ARM Cortex-A76 cores with up to 2.2 GHz and 6x small and power efficient ARM Cortex-A55 cores (max. 2 GHz) in two clusters (bigLITTLE). The chip integrates an ARM Mali-G57 MC2 (two cores). Compared to the older Helio G96, the G99 is manufactured in the more recent 6nm process and clocks higher.
Furthermore, the integrated LTE / 4G modem supports Cat-13 download speeds. Wi-Fi 5 is also integrated (a/b/g/n/ac). The memory controller supportsLPDDR4x with up to 4,266 Mbps.
MediaTek Dimensity 810
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The Mediatek Dimensity 810 is a fast mid-range SoC with an integrated 5G modem. It includes two fast ARM Cortex-A76 cores at up to 2.4 GHz and six power efficient Cortex-A55 cores at up to 2 GHz (Octa-Core with Heterogeneous Multi-Processing). Furthermore, the chip integrates a 2 core ARM Mali-G57 MC2 GPU, a Wi-fi 5 modem, a LPDDR4x memory controller(up to 16 GB with 2133 MHz), a AI processing unit (APU 3.0) and video de- and encoding.
The integrated 5G modem supports dual-5G (Sub6) with up to 2.77 GBit/s download.
The Dimensity 800 is manufactured in the modern 6nm process at TSMC and should be very power efficient.
MediaTek Dimensity 700
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The Mediatek Dimensity 700 is a fast mid-range SoC with an integrated 5G modem. It includes two fast ARM Cortex-A76 cores at up to 2.2 GHz and six power efficient Cortex-A55 cores at up to 2 GHz (Octa-Core with Heterogeneous Multi-Processing). Compared to the similar Dimensity 800U, the 700 offers lower clocked CPU cores (-200 MHz) and a slower GPU (one less core).
Furthermore, the chip integrates a 2 core ARM Mali-G57 MC2 GPU, a Wi-fi 5 modem, a LPDDR4x-2133 memory controller, a AI processing unit (APU 3.0) and video de- and encoding.
The Dimensity 700 is manufactured in the modern 7nm process and should be very power efficient.
Model | Mediatek Helio G99 | MediaTek Dimensity 810 | MediaTek Dimensity 700 | ||||||||||||||||||||
Codename | Cortex-A76 / A55 | Cortex-A76 / A55 | Cortex-A76 / A55 | ||||||||||||||||||||
Series | Mediatek Mediatek Helio G | ||||||||||||||||||||||
Series: Mediatek Helio G Cortex-A76 / A55 |
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Clock | 2000 - 2200 MHz | 2000 - 2400 MHz | 2000 - 2200 MHz | ||||||||||||||||||||
Cores / Threads | 8 / 8 2 x 2.2 GHz ARM Cortex-A76 6 x 2.0 GHz ARM Cortex-A55 | 8 / 8 | 8 / 8 2 x 2.2 GHz ARM Cortex-A76 6 x 2.0 GHz ARM Cortex-A55 | ||||||||||||||||||||
Technology | 6 nm | 6 nm | 7 nm | ||||||||||||||||||||
Features | 2x Cortex-A76, 6x Cortex-A55, 4G LTE Cat-12/13, 64MP AI-Camera support, LPDDR3/LPDDR4x-2133, eMMC 5.1, UFS 2.1, Beidou, Galileo, Glonass, GPS, Wi-Fi 5 (a/b/g/n/ac), AI Accelerator up to 1 TMACs, H.264 / H.265 / HEVC video encoding (4k30) | 2x ARM Cortex-A76 (2.4 GHz), 6x ARM Cortex-A55 (2 GHz), ARM Mali-G57 MP2, Wi-Fi 5, Bluetooth 5.1, UFS 2.2, LPDDR4x Support; SA & NSA modes; SA Option2, NSA Option3 / 3a / 3x, NR TDD Band, NR FDD Band, DSS, NR DL 2CC, 120 MHz bandwidth, 256QAM NR UL 2CC, | 2x ARM Cortex-A76 (2.2 GHz), 6x ARM Cortex-A55 (2 GHz), ARM Mali-G75 MC2, APU 3.0, 5G Modem (2CC), MiraVision (4K HDR Video, 80MP Photo), Wi-Fi 5, Bluetooth 5.1, UFS 2.2, 16GB LPDDR4x Support | ||||||||||||||||||||
iGPU | ARM Mali-G57 MP2 | ARM Mali-G57 MP2 ( - 1068 MHz) | ARM Mali-G57 MP2 ( - 950 MHz) | ||||||||||||||||||||
Architecture | ARM | ARM | ARM | ||||||||||||||||||||
Announced | |||||||||||||||||||||||
Manufacturer | www.mediatek.com | www.mediatek.com | www.mediatek.com |
Benchmarks
Average Benchmarks Mediatek Helio G99 → 100% n=13
Average Benchmarks MediaTek Dimensity 810 → 95% n=13
Average Benchmarks MediaTek Dimensity 700 → 87% n=13

* Smaller numbers mean a higher performance
1 This benchmark is not used for the average calculation