MediaTek Dimensity 720 vs MediaTek Dimensity 800 vs UNISOC Tangula T760
MediaTek Dimensity 720► remove from comparison
The Mediatek Dimensity 720 is a mid-range SoC with an integrated 5G modem. It includes four fast ARM Cortex-A76 cores and four power efficient Cortex-A55 cores, all clocked at up to 2 GHz (Octa-Core with Heterogeneous Multi-Processing). Furthermore, the chip integrates a 3 core ARM Mali-G57 MC3 GPU, a Wi-fi 5 modem, a LPDDR4x memory controller, a AI processing unit (APU) and video de- and encoding. Compared to the faster Dimensity 820, the CPU cores are lower clocked and the GPU offers less cores. Furthermore, all other features were slightly restricted (e.g. max. 12 GB RAM).
The Dimensity 720 is manufactured in the modern 7nm process and should be very power efficient.
MediaTek Dimensity 800► remove from comparison
The Mediatek Dimensity 800 is a fast mid-range SoC with an integrated 5G modem. It includes four fast ARM Cortex-A76 cores at up to 2 GHz and four power efficient Cortex-A55 cores at up to 2 GHz (Octa-Core with Heterogeneous Multi-Processing). Furthermore, the chip integrates a 4 core ARM Mali-G57 MC4 GPU, a Wi-fi 5 modem, a LPDDR4x memory controller(up to 16 GB with 2133 MHz), a AI processing unit (APU 3.0) and video de- and encoding.
Compared to the similar named Dimensity 800U, the 800 offers two more big A76 cores but clocked 400 MHz lower. This means the single core performance is lower, but the multi-core performance can be better.
The Dimensity 800 is manufactured in the modern 7nm process and should be very power efficient.
UNISOC Tangula T760► remove from comparison
The Unisoc T760 Tanggula (former Spreadtrum) is a mid range SoC for Android based smartphones and tablets. It integrates an octa-core CPU with two clusters. Four fast ARM Cortex-A76 cores clocked at up to 2 GHz and four small ARM-Cortex-A55 cores at again up to 2 GHz for efficiency. The faster T770 SoC offers higher clocked A76 cores in comparison (up to 2.5 GHz for a single core).
One fast ARM Cortex-A76 clocked at up to 2.5 GHz, three more A76 performance cores clocked at up to 2.2 GHz and a power efficiency cluster of four ARM-Cortex-A55 cores with up to 2 GHz. The integrated memory controller supports LPDDR4/4X with up to 2133 MHz (2x 16 Bit). The integrated ISP supports two main cameras and two subsidiary cameras (up to 108 MPix). The integrated graphics card is an ARM Mali-G57 MC4 (4 cores) at up to 780 MHz. Unisoc also specifies that the T770 offers hardware AI acceleration.
The chip is manufactured in the modern 6nm process.
|Model||MediaTek Dimensity 720||MediaTek Dimensity 800||UNISOC Tangula T760|
|Codename||Cortex-A76 / A55||Cortex-A76 / A55||Cortex-A76 / A55|
|Series: Cortex-A76 / A55|
|Clock||2000 MHz||2000 MHz||2000 - 2000 MHz|
|Cores / Threads||8 / 8||8 / 8||8 / 8|
|Technology||7 nm||7 nm||6 nm|
|Features||4x ARM Cortex-A76 (2 GHz), 4x ARM Cortex-A55 (2 GHz), ARM Mali-G57 MC3, APU 3.0, 5G Modem, MiraVision (4K30 Video, 64MP Photo), Wi-Fi 5, Bluetooth 5.1, UFS 2.2, 12GB LPDDR4x Support||4x ARM Cortex-A76 (2 GHz), 4x ARM Cortex-A55 (2 GHz), ARM Mali-G75 MC5, APU 3.0, 5G Modem (2CC), MiraVision (4K HDR Video, 80MP Photo), Wi-Fi 5, Bluetooth 5.1, UFS 2.2, 16GB LPDDR4x Support||ISP (2 main + 2 subsidiary, 108M 4-in-1, 64M ZSL)|
|iGPU||ARM Mali-G57 MP3||ARM Mali-G57 MP4||ARM Mali-G57 MP4 ( - 650 MHz)|
|Manufacturer||Mediatek Dimensity 720|
|L3 Cache||3 MB|