Intel Core i5-7267U vs Intel Celeron 5205U vs Intel Celeron 3865U

Intel Core i5-7267U

The Intel Core i5-7267U is a fast dual-core SoC for notebooks based on the Kaby Lake architecture and was announced in January 2017. The CPU has two processor cores clocked at 3.1-3.5 GHz (two cores also up to 3.5 GHz). The processor can execute up to four threads simultaneously thanks to Hyper Threading. It is also equipped with an Intel Iris Plus Graphics 650 GPU with 64 MB eDRAM, a dual-channel memory controller (DDR4) as well as VP9 and H.265 video decoding as well as encoding. The chip is still manufactured in a 14nm process with FinFET transistors.

Architecture

Intel basically uses the same micro architecture compared to Skylake, so the per-MHz performance does not differ. The manufacturer only reworked the Speed Shift technology for faster dynamic adjustments of voltages and clocks, and the improved 14nm process allows much higher frequencies combined with better efficiency than before.

Performance

The performance of the 28-Watt CPU should be on par with the Core i7-7500U (2.7-3.5 GHz, no eDRAM, 15 Watts), but it should be a bit slower on practice due to the missing level 4 eDRAM and the lower TDP. This means the i5 is still one of the faster dual-core processors and should be sufficient for most scenarios. Some games might still require a real quad-core processor and therefore nit run perfectly on the dual-core processor, despite Hyper Threading.

Graphics

The integrated Intel Iris Plus 650 Graphics is the GT3e model of the Kaby Lake GPU (Intel Gen. 9.5). It has 48 Execution Units running at 300-1050 MHz and the performance is comparable to a GeForce 920MX thanks to fast eDRAM cache. However, there aren't any significant improvements compared to the old Iris Pro 550, so modern games can often not be played smoothly or only at the lowest or medium settings, respectively.

Contrary to Skylake, Kaby lake now also supports H.265/HEVC Main 10 with a 10-bit color depth as well as Google's VP9 codec. The dual-core Kaby Lake processors announced in January should also support HDCP 2.2.

Power Consumption

The chip is manufactured in an improved 14nm process with FinFET transistors, which improves the efficiency even further. Intel specifies the TDP with 28 Watts, which can be reduced to 23 Watts (cTDP Down) depending on the usage scenario. The TDP is pretty high compared to the common 15-Watt TDP for dual-core processors, but allows a better utilization of CPU and GPU Turbo.

Intel Celeron 5205U

The Intel Celeron 5205U is a power efficient entry-level dual-core SoC for notebooks based on the Comet Lake (CML-U) generation and was announced in October 2019. Compared to the similar Whiskey Lake Celeron 4205U processors, the difference is the higher clock speed (+100 MHz) and support for faster memory. The processor cores are clocked at only 1.9 GHz (no Turbo) and don't support SMT / HyperThreading (so only 2 threads). More information on Comet Lake and all the models and articles on it can be found here.

The integrated graphics adapter is still the same as in the previous generations. It is called only Intel UHD Graphics but is still the same Intel UHD Graphics 610 like in the Pentium 4205U. Furthermore, the SoC integrates a VP9 and H.265 de- and encoder and an integrated dual channel LPDDR3-2133/DDR4-2400 memory controller (compared to DDR4-2666 in the faster and costlier Core i3/i5/i7 processors).

Performance

While we have not tested a single system powered by the 5205U as of August 2023, it's safe to expect the chip to be about half as fast as the Core i3-10110U (Comet Lake, 2 cores, 4 threads, up to 4.1 GHz). Which is nothing to write home about, really, as of mid 2022.

Power consumption

This Celeron has a default TDP, also known as the long-term power limit, of 15 W. Intel officialy allows laptop manufacturers to reduce that value somewhat, 12.5 W being the lower limit, resulting in lower clock speeds and lower performance. Unlike most Comet Lake family processors, Celeron 5205U is fairly likely to actually stick to that limitation as its cores are not Boost-enabled.

Last but not the least, this CPU is manufactured on an old, as of late 2022, 14 nm Intel process making for subpar energy efficiency.

Intel Celeron 3865U

The Intel Celeron 3865U is an ULV (ultra low voltage) dual-core SoC based on the Kaby-Lake architecture and has been launched in the first quarter of 2017. The CPU can be found in ultrabooks as well as normal notebooks. In addition to two CPU cores clocked at 1.8 GHz (no Turbo Boost, no HyperThreading), the chip also integrates an HD Graphics 610 GPU and a dual-channel DDR4-2133/DDR3L-1600 memory controller. The SoC is manufactured using a 14 nm process with FinFET transistors.

Architecture

Intel basically uses the same micro architecture compared to Skylake, so the per-MHz performance does not differ. The manufacturer only reworked the Speed Shift technology for faster dynamic adjustments of voltages and clocks, and the improved 14nm process allows much higher frequencies combined with better efficiency than before.

Performance

Due to the missing Turbo Boost and the low clock speeds, especially the single thread performance is very limited which results in a lower performance even for lower demanding tasks. The performance should be noticeably slower than the Celeron 3965 which offers 400 MHz higher clocked CPU cores. Therefore, the CPU is only suited for entry level tasks like office, web surfing and multimedia.

Graphics

The integrated graphics unit called HD Graphics 610 (similar to the HD Graphics 510) represents the "GT1" version of the Kaby Lake GPU (Intel Gen. 9). Its 12 Execution Units, also called EUs, are clocked at 300 - 900 MHz and offer a performance somewhat below the older HD Graphics 4400. Only a few games of 2015 can be played smoothly in lowest settings.

Power Consumption

Specified at a TDP of 15 W (including CPU, GPU and memory controller), the CPU is best suited for small notebooks and ultrabooks (11-inches and above). Optionally, the TDP can be lowered to 10 watts (cTDP down), reducing both heat dissipation and performance and allowing even more compact designs.