UFS 3.0 storage coming next year, LPDDR5 in 2020

The LPDDR5 DRAM memory and the UFS 3.0 storage solutions might not be on the market yet as previously promised, but — at least when talking about the next-wave UFS chips — they are not too far behind schedule, either. If everything works as expected, LPDDR5 should hit the market in 2020, but the UFS 3.0 chips should be ready in the first half of 2019.

Samsung's head of mobile memory product planning, Jay Oh, has recently talked about these upcoming products at the Qualcomm 4G/5G Summit in Hong Kong. According to him, UFS 3.0 will hit the market in 128 GB, 256 GB, and 512 GB storage variants. The first 1 TB module should be unveiled in 2012, but 1 TB handsets that use two 512 GB modules will hit the market by then (just take a look at this video, I am not saying more). UFS 3.0 memory promises to deliver twice the bandwidth of the UFS 2.1 standard and will surely be an excellent choice for the upcoming 5G phones.

Unfortunately, Samsung and Micron will only bring LPDDR5 to the market in 2020. Samsung plans to kick off production of the next-gen memory chips the same year, so the first products to use it will probably need at least a few months before rolling out. LPDDR5 DRAM should use 20 percent less power than the existing LPDDR4 DRAM chips and could deliver a bandwidth of up to 51.2 GB/s.