UNISOC Tangula T770 vs Apple A15 Bionic vs MediaTek Dimensity 820

UNISOC Tangula T770

The Unisoc T770 Tanggula (former Spreadtrum) is a mid range SoC for Android based smartphones and tablets. It integrates an octa-core CPU with three clusters. One fast ARM Cortex-A76 clocked at up to 2.5 GHz, three more A76 performance cores clocked at up to 2.2 GHz and a power efficiency cluster of four ARM-Cortex-A55 cores with up to 2 GHz. The integrated memory controller supports LPDDR4/4X with up to 2133 MHz (2x 16 Bit). The integrated ISP supports two main cameras and two subsidiary cameras (up to 108 MPix). The integrated graphics card is an ARM Mali-G57 MC4 (4 cores) at up to 780 MHz. Unisoc also specifies that the T770 offers hardware AI acceleration.

The chip is manufactured in the modern 6nm process.

Apple A15 Bionic

The Apple A15 Bionic is a System on a Chip (SoC) from Apple that is found in the iPhone 13 and iPad Mini (2021) models. It was announced late 2021 and offers 6 cores divided in 2 performance cores and four power efficiency cores. The CPU performance increases only slightly compared to the A14, but GPU (in the higher end models) offers higher gains.

The chip is manufactured in 5nm and integrates 15.8 billion transistors (compared to the 11.8 of the A14).

MediaTek Dimensity 820

The Mediatek Dimensity 820 is a fast mid-range SoC with an integrated 5G modem. It includes four fast ARM Cortex-A76 cores at up to 2.6 GHz and four power efficient Cortex-A55 cores at up to 2 GHz (Octa-Core with Heterogeneous Multi-Processing). Furthermore, the chip integrates a 5 core ARM Mali-G57 MC5 GPU, a Wi-fi 5 modem, a LPDDR4x memory controller, a AI processing unit (APU 3.0) and video de- and encoding. The Dimensity 820 is manufactured in the modern 7nm process and should be very power efficient.