UNISOC Tangula T770 vs MediaTek Dimensity 820
UNISOC Tangula T770► remove from comparison
The Unisoc T770 Tanggula (former Spreadtrum) is a mid range SoC for Android based smartphones and tablets. It integrates an octa-core CPU with three clusters. One fast ARM Cortex-A76 clocked at up to 2.5 GHz, three more A76 performance cores clocked at up to 2.2 GHz and a power efficiency cluster of four ARM-Cortex-A55 cores with up to 2 GHz. The integrated memory controller supports LPDDR4/4X with up to 2133 MHz (2x 16 Bit). The integrated ISP supports two main cameras and two subsidiary cameras (up to 108 MPix). The integrated graphics card is an ARM Mali-G57 MC4 (4 cores) at up to 780 MHz. Unisoc also specifies that the T770 offers hardware AI acceleration.
The chip is manufactured in the modern 6nm process.
MediaTek Dimensity 820► remove from comparison
The Mediatek Dimensity 820 is a fast mid-range SoC with an integrated 5G modem. It includes four fast ARM Cortex-A76 cores at up to 2.6 GHz and four power efficient Cortex-A55 cores at up to 2 GHz (Octa-Core with Heterogeneous Multi-Processing). Furthermore, the chip integrates a 5 core ARM Mali-G57 MC5 GPU, a Wi-fi 5 modem, a LPDDR4x memory controller, a AI processing unit (APU 3.0) and video de- and encoding. The Dimensity 820 is manufactured in the modern 7nm process and should be very power efficient.
|Model||UNISOC Tangula T770||MediaTek Dimensity 820|
|Codename||Cortex-A76 / A55||Cortex-A76 / A55|
|Series: Cortex-A76 / A55|
|Clock||2000 - 2500 MHz||2000 - 2600 MHz|
|Cores / Threads||8 / 8||8 / 8|
|Technology||6 nm||7 nm|
|Features||ISP (2 main + 2 subsidiary, 108M 4-in-1, 64M ZSL)||4x ARM Cortex-A76 (2.6 GHz), 4x ARM Cortex-A55 (2 GHz), ARM Mali-G57 MC5, APU 3.0, 5G Modem (2CC), MiraVision (4K HDR Video, 80MP Photo), Wi-Fi 5, Bluetooth 5.1, UFS 2.2, 16GB LPDDR4x Support|
|iGPU||ARM Mali-G57 MP4 ( - 780 MHz)||ARM Mali-G57 MP5|
|Manufacturer||Mediatek Dimensity 820|