AMD Ryzen AI 9 HX PRO 370 vs AMD Ryzen AI Max+ PRO 395

AMD Ryzen AI 9 HX PRO 370

The AMD Ryzen AI 9 HX PRO 370 is a powerful Strix Point family processor that debuted in October 2024. The APU comes with 12 CPU cores running at 2.0 GHz to 5.1 GHz, the 16 CU RDNA 3+ Radeon 890M graphics adapter and the 50 INT8 TOPS XDNA 2 neural engine. Other noteworthy features include PCIe 4, USB 4 and LPDDR5x-8000 RAM support. Unlike it is with the non-PRO AI 9 HX 370 chip, the AMD Secure Processor (an on-package ARM co-processor) is onboard, as well as a few other higher-end features such as AMD-Vi.

Of the 12 CPU cores, 4 are full Zen 5 cores and the remaining 8 are smaller Zen 5c cores. With a top clock speed of just 3.3 GHz, the latter are not just less complex but also run at significantly lower clock speeds.

Architecture and Features

Strix Point family APUs are powered by Zen 5 and Zen 5c microarchitecture cores found in two separate clusters, the latter being a slower, smaller and more energy-efficient version of the former. One of the differences between Zen 5 and Zen 5c is the cache size; Zen 5 cores have larger caches to work with.

Either way, mobile Zen 5 is reportedly (ChipsAndCheese) closer to desktop Zen 4 than to desktop Zen 5 due to differing cache sizes, vast differences in AVX-512 throughput and other factors, such as the lack of PCIe 5 support.

Elsewhere, the Ryzen AI 9 PRO chip supports DDR5-5600 and LPDDR5x-8000 ECC and non-ECC RAM, giving system designers a choice between lower latency and higher throughput respectively. The APU is natively compatible with USB 4 (and therefore Thunderbolt). Its PCIe controller is capped at 4.0 speeds which is 1.9 GB/s per lane, just like it was with the 8000 series predecessors. The integrated XDNA 2 NPU is a lot more complex than the first-gen XDNA was, and delivers up to 55 INT8 TOPS for various AI workloads such as Copilot.

As usual for laptop CPUs, the Ryzen is not user-replaceable as it gets soldered down for good.

Performance

While we have not tested a single system powered by the HX PRO 370, we do have plenty of benchmark results for its non-PRO brother. The most important specs are identical between the two. Therefore, it is reasonable to expect HX PRO 370-toting systems to deliver multi-thread performance on par with laptops and mini-PCs powered by the Core i7-13650HX (Raptor Lake, 6 P-cores, 8 E-cores, 157 W short-term power target). The Ryzen AI 9 HX PRO 375 and its non-Pro sibling are going to be very close nearby as well, since their only advantage over the two 370 chips is the slightly faster 55 TOPS NPU.

Graphics

The Radeon 890M is the most powerful iGPU on the market, as of Q4 2024. It features 16 RDNA 3+ architecture CUs/WGPs; that's 1024 unified shaders that run at up to 2,900 MHz.

Naturally, the Radeon is capable of driving four SUHD 4320p60 monitors simultaneously. It can also efficiently encode and decode the most popular video codecs such as AVC, HEVC, VP9 and AV1. The latest addition to that list, the VVC codec, is not supported unlike it is with Intel Lunar Lake chips.

As for its performance, the graphics adapter can be as slow as the Arc 8 or as fast as the RTX 2050 Laptop depending on the benchmark or game. On average, the 890M finds itself very close to the GTX 1650 Laptop making it possible to play 2024 AAA games at 1080p with most settings set to Low. Baldur's Gate 3 is playable on medium settings, as are several other 2023 games.

Power consumption

The 370 is supposed to have a base TDP of 28 W, with laptop makers free to crank it up to up to 54 W which they actually do to maximize performance. The highest we've seen as of October 2024 was 80 W.

Strix Point chips are a single-die design. The TSMC N4P process that they are built with allows for very decent, as of Q4 2024, power efficiency.

AMD Ryzen AI Max+ PRO 395

The AMD Ryzen AI Max+ PRO 395 is a powerful Strix Halo family processor that debuted in January 2025. The APU comes with 16 Zen 5 CPU cores running at up to 5.1 GHz, the 40 CU RDNA 3+ Radeon 8060S graphics adapter and the 50 TOPS XDNA 2 neural engine. Unlike its non-PRO sibling, the chip features AMD Secure Processor (an on-package ARM security co-processor), Windows Device Guard and AMD-Vi. Other noteworthy features include PCIe 4, USB 4 and LPDDR5x-8000 RAM support and a whole lot of L3 cache.

Architecture and Features

Unlike Strix Point, Strix Halo parts are powered by Zen 5 cores - no Zen 5c here. It's not clear if this is the desktop Zen 5 implementation with full AVX512 throughput or the mobile one. According to AMD, Zen 5 delivers a 16% IPC improvement over Zen 4 thanks to branch prediction improvements and other refinements.

Elsewhere, the AI Max+ PRO chip supports RAM as fast as LPDDR5x-8000, and is natively compatible with USB 4 (and therefore Thunderbolt). It has PCIe 4.0 support for a throughput of 1.9 GB/s per lane, just like its 8000 series predecessors had. The integrated XDNA 2 NPU delivers up to 50 INT8 TOPS for accelerating various AI workloads.

Performance

From leaks, we know that the Ryzen delivers around 20,700 Geekbench 6.3 Multi points, meaning it trades blow with very powerful desktop CPUs like the Ryzen 9 9900X.

Graphics

The Radeon 8060S is the most powerful iGPU that AMD has on offer, as of Jan 2025. It features 40 RDNA 3+ architecture CUs (2560 unified shaders) that could see it outcompeting lower mid-range desktop graphics cards like the GeForce RTX 4050. This GPU will undoubtedly run any game at 1080p on Ultra, however, the ultimate question is whether or not the cooling solution of the laptop will be powerful enough to let the iGPU shine.

Naturally, the Radeon is capable of driving four SUHD 4320p60 monitors. It can also efficiently encode and decode the most popular video codecs including AVC, HEVC, VP9 and AV1. The latest addition to that list, the VVC codec, is not supported unlike it is with Intel Lunar Lake chips.

Power consumption

The AI Max+ PRO 395 can eat up to 120 W depending on the system and its TDP power targets, with 45 W named as the minimum TDP.

The 4 nm TSMC process that the CPU cores are built with make for decent, as of Jan 2025, energy efficiency.