Mediatek Helio G99 vs Unisoc T9100 (T820) vs MediaTek Dimensity 6100+
Mediatek Helio G99
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The Mediatek Helio G99 is a mainstream ARM SoC for smartphones (mainly Android based) that was introduced in 2022. It is manufactured in a 6 nm FinFET process and is equipped with 2x big ARM Cortex-A76 cores with up to 2.2 GHz and 6x small and power efficient ARM Cortex-A55 cores (max. 2 GHz) in two clusters (bigLITTLE). The chip integrates an ARM Mali-G57 MC2 (two cores). Compared to the older Helio G96, the G99 is manufactured in the more recent 6nm process and clocks higher.
Furthermore, the integrated LTE / 4G modem supports Cat-13 download speeds. Wi-Fi 5 is also integrated (a/b/g/n/ac). The memory controller supportsLPDDR4x with up to 4,266 Mbps.
Unisoc T9100 (T820)
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The Unisoc T9100 (formely Unisoc T820) is a mid range SoC for Android based smartphones and tablets. It integrates an octa-core CPU with three clusters. One fast ARM Cortex-A76 clocked at up to 2.7 GHz, three more A76 performance cores clocked at up to 2.3 GHz and a power efficiency cluster of four ARM-Cortex-A55 cores with up to 2.1 GHz. The integrated memory controller supports LPDDR4/4X with up to 2133 MHz (2x 16 Bit). The integrated ISP supports two main cameras and two subsidiary cameras (up to 108 MPix). The integrated graphics card is an ARM Mali-G57 MC4 (4 cores) at up to 850 MHz. Unisoc also specifies that the T9100 offers hardware AI acceleration with up to 8.0 TOPS peak performance of the NPU.
The chip is manufactured on the modern 6nm EUV process.
MediaTek Dimensity 6100+
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The Mediatek Dimensity 6100+ (or 6100 Plus, MT6835V/ZA) is a lower mid-range SoC with an integrated 5G modem. It includes two fast ARM Cortex-A76 cores at up to 2.2 GHz and six power efficient Cortex-A55 cores at up to 2 GHz (Octa-Core with Heterogeneous Multi-Processing). The specifications are similar to the old Dimensity 700 SoC and nearly identical to the Dimensity 6020. Compared to the 6020, the 6100+ offers slightly higher 5 G speeds (3.3 vs 2.7 Gbps), Bluetooth 5.2 (vs 5.1) support, and is manufactured in the slightly improved 6nm process (vs 7nm).
Furthermore, the chip integrates a 2 core ARM Mali-G57 MC2 GPU, a Wi-fi 5 modem, a LPDDR4x-2133 memory controller, a AI processing unit (APU 3.0) and video de- and encoding.
Model | Mediatek Helio G99 | Unisoc T9100 (T820) | MediaTek Dimensity 6100+ | ||||||||||||||||||||||||||||||||
Codename | Cortex-A76 / A55 | Cortex-A76 / A55 | Cortex-A76 / A55 | ||||||||||||||||||||||||||||||||
Series | Mediatek Mediatek Helio G | Mediatek Dimensity 6000 | |||||||||||||||||||||||||||||||||
Series: Dimensity 6000 Cortex-A76 / A55 |
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Clock | 2000 - 2200 MHz | 2100 - 2700 MHz | 2000 - 2200 MHz | ||||||||||||||||||||||||||||||||
Cores / Threads | 8 / 8 2 x 2.2 GHz ARM Cortex-A76 6 x 2.0 GHz ARM Cortex-A55 | 8 / 8 | 8 / 8 2 x 2.2 GHz ARM Cortex-A76 6 x 2.0 GHz ARM Cortex-A55 | ||||||||||||||||||||||||||||||||
Technology | 6 nm | 6 nm | 6 nm | ||||||||||||||||||||||||||||||||
Features | 2x Cortex-A76, 6x Cortex-A55, 4G LTE Cat-12/13, 64MP AI-Camera support, LPDDR3/LPDDR4x-2133, eMMC 5.1, UFS 2.1, Beidou, Galileo, Glonass, GPS, Wi-Fi 5 (a/b/g/n/ac), AI Accelerator up to 1 TMACs, H.264 / H.265 / HEVC video encoding (4k30) | ISP (2 main + 2 subsidiary, 108M 9-in-1, 64M ZSL) | 2x ARM Cortex-A76 (2.2 GHz), 6x ARM Cortex-A55 (2 GHz), ARM Mali-G75 MC2, APU 3.0, 5G Modem (2CC), MiraVision, Wi-Fi 5, Bluetooth 5.2, UFS 2.2, 16GB LPDDR4x Support | ||||||||||||||||||||||||||||||||
iGPU | ARM Mali-G57 MP2 | ARM Mali-G57 MP4 ( - 850 MHz) | ARM Mali-G57 MP2 | ||||||||||||||||||||||||||||||||
Architecture | ARM | ARM | ARM | ||||||||||||||||||||||||||||||||
Announced | |||||||||||||||||||||||||||||||||||
Manufacturer | www.mediatek.com | www.mediatek.com |
Benchmarks
Average Benchmarks Mediatek Helio G99 → 100% n=8
Average Benchmarks Unisoc T9100 (T820) → 129% n=8
Average Benchmarks MediaTek Dimensity 6100+ → 96% n=8

* Smaller numbers mean a higher performance
1 This benchmark is not used for the average calculation