Dimensity 9300: Early details of MediaTek's Snapdragon 8 Gen 3 rival surface

MediaTek released the Dimensity 9200 at the tail end of last year. Thanks in part, however, to the immense success of Qualcomm's Snapdragon 8 Gen 2, the MediaTek flagship chipset has seen low adoption, supposedly setting the company's sights on a direct successor to take on Qualcomm's next-gen flagship SoC.

According to Chinese leaker Digital Chat Station, MediaTek is already focusing on the successor to the Dimensity 9200. Said chipset looks to be branded as the Dimensity 9300, and is being developed in collaboration with Vivo. That last bit makes sense, as Vivo—and its siblings under the BBK Electronics umbrella—are the only adopters of the Dimensity 9200 so far. Specifically, Vivo's next-gen flagship, the Vivo X100, is also expected to be powered by the Dimensity 9300.

Reportedly, the Dimensity 9300 will be built on TSMC's N4P node, likely the same process that will underpin Qualcomm's Snapdragon 8 Gen 3. As reported previously, neither MediaTek nor Qualcomm will have access to TSMC's 3 nm process until next year. In any case, the Dimensity 9300 can be expected to outperform the 9200 by a significant margin, with Digital Chat Station highlighting big GPU improvements especially. Whether those improvements will suffice to match the Snapdragon 8 Gen 3 is a different discussion, however. 

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