MediaTek Dimensity 8200-Ultra vs Mediatek Helio G99 vs Mediatek Helio G95

MediaTek Dimensity 8200-Ultra

The MediaTek Dimensity 8200-Ultra is a upper mid-range ARM-based SoC (system-on-a-chip) that is manufactured using the modern 4 nm process. It was specially designed for use in Android smartphones and is in the upper class in terms of performance. It supports all current mobile communication standards, including 5G SA. 

The CPU works with a total of eight cores, which are divided into two clusters. In the first cluster, an ARM Cortex-A78 power core clocked at 3.1 GHz is joined by three further ARM Cortex-A78 power cores clocked at 3 GHz. In the second cluster, four ARM Cortex-A55 power cores operate at 2.0 GHz. LPDDR5 RAM can be used as RAM and UFS 3.1 is supported as internal memory. 

In terms of connectivity, dual 5G with a theoretical peak download speed of up to 4.7 GBit/s is available, as well as WiFi 6E and Bluetooth 5.3.

The Mediatek Dimensity 8200-Ultra is a variant of the otherwise identical Mediatek Dimensity 8200 that has been specially customised for Xiaomi and features improvements to the camera ISP. An Imagiq 785 image processor is responsible for processing the camera data. Video recordings are supported with up to 4K at 60 fps. The CPU part of the older Dimensity 8100 is very similar and offers the same CPU and GPU cores.

The integrated ARM Mali-G610 MC6 graphics unit can power displays with a resolution of up to 2,960 x 1,440 pixels (WQHD+) and a refresh rate of up to 120 Hz. With Full HD+, even up to 180 Hz is possible.

Mediatek Helio G99

The Mediatek Helio G99 is a mainstream ARM SoC for smartphones (mainly Android based) that was introduced in 2022. It is manufactured in a 6 nm FinFET process and is equipped with 2x big ARM Cortex-A76 cores with up to 2.2 GHz and 6x small and power efficient ARM Cortex-A55 cores (max. 2 GHz) in two clusters (bigLITTLE). The chip integrates an ARM Mali-G57 MC2 (two cores). Compared to the older Helio G96, the G99 is manufactured in the more recent 6nm process and clocks higher.

Furthermore, the integrated LTE / 4G modem supports Cat-13 download speeds. Wi-Fi 5 is also integrated (a/b/g/n/ac). The memory controller supportsLPDDR4x with up to 4,266 Mbps.

Mediatek Helio G95

The Mediatek Helio G95 is an upper mainstream ARM SoC for smartphones (mainly Android based) that was introduced in 2020. It is manufactured in a 12 nm FinFET process and is equipped with 2x big ARM Cortex-A76 cores with up to 2.05 GHz and 6x small and power efficient ARM Cortex-A55 cores (max. 2 GHz) in two clusters (bigLITTLE). The chip also integrates a ARM Mali-G76 3EEMC4 (should be a MP4 - four cluster variant) clocked at 900 MHz. Compared to the similar Helio G90T, the difference is the 100 MHz higher clocked graphics card.

Furthermore, the integrated LTE modem supports Cat-12 600 Mbps download and Cat-13 150 Mbps upload speeds. Wi-Fi 5 is also integrated (a/b/g/n/ac). The memory controller supports LPDDR3 and LPDDR4x with up to 2,133 MHz with up to 10 GB capacity.