MediaTek Dimensity 800U vs Qualcomm Snapdragon 730G vs MediaTek Dimensity 820

MediaTek Dimensity 800U

The Mediatek Dimensity 800U is a fast mid-range SoC with an integrated 5G modem. It includes two fast ARM Cortex-A76 cores at up to 2.4 GHz and six power efficient Cortex-A55 cores at up to 2 GHz (Octa-Core with Heterogeneous Multi-Processing). Furthermore, the chip integrates a 3 core ARM Mali-G57 MC3 GPU, a Wi-fi 5 modem, a LPDDR4x memory controller, a AI processing unit (APU 3.0) and video de- and encoding.

Compared to the Dimensity 820, the 800U offers lower clocked A76 cores and a slower GPU.

The Dimensity 800U is manufactured in the modern 7nm process and should be very power efficient.

Qualcomm Snapdragon 730G

The Qualcomm Snapdragon 730G (SD730G Mobile Platform) is a fast mid-range ARM-based SoC largely found on Android tablets and smartphones. It integrates eight cores (octa-core) divided into two clusters. A fast performance cluster contains two ARM Cortex-A76 cores clocked at up to 2.2 GHz and a power efficiency cluster with six small ARM Cortex-A55 cores at up to 1.8 GHz. Depending on the workload only single clusters or all cores can run at different clock speeds.

Compared to the normal Snapdragon 730, the 730G is optimized for gaming. This means the graphics card is higher clocked and the chip also offers optimized WiFi. The GPU also supports higher resolutions. Furthermore, the SoC is able to record videos in 720p with up to 960 fps.

The chip includes a range of other features like a fast X15 LTE radio (800 Mbits Cat 15 download, 150 Mbps Cat 13 upload), one of the first Wi-Fi 6 wireless radios (802.11ax), satellite positioning (GPS, QZSS, GLONASS, SBAS, Beidou, Galileo), USB-C 3.1, Spectra 350 ISP, Hexagon 688 DSP, H.265 4K30 video en- and decode, an LPDDR4X-3733 dual-channel memory controller and a Adreno 618 graphics card.

The Snapdragon 730G is manufactured in the modern 8 nm process at Samsung.

MediaTek Dimensity 820

The Mediatek Dimensity 820 is a fast mid-range SoC with an integrated 5G modem. It includes four fast ARM Cortex-A76 cores at up to 2.6 GHz and four power efficient Cortex-A55 cores at up to 2 GHz (Octa-Core with Heterogeneous Multi-Processing). Furthermore, the chip integrates a 5 core ARM Mali-G57 MC5 GPU, a Wi-fi 5 modem, a LPDDR4x memory controller, a AI processing unit (APU 3.0) and video de- and encoding. The Dimensity 820 is manufactured in the modern 7nm process and should be very power efficient.