AMD’s Ryzen embedded processor refresh usually lags by around 1 year from the launch of a major architecture upgrade. For example, the V2000 embedded lineup based on the Zen 2 architecture was launched last November, when AMD already had launched the Zen 3 desktop processors. We are expecting to see the upcoming V3000 lineup in November or later this year, but, according to a new leak coming from Patrick Schur on Twitter, it looks like the new embedded processors will not feature the Zen 3 architecture launched in October last year. Instead, these processors will be the first to feature the Zen 3+ architecture even before the desktop models with improved V-Cache or the laptop models codenamed Rembrandt that are supposed to launch in early 2022.
Zen 3+ will be produced on the 6 nm nodes at TSMC, so not really much of a performance and energy efficiency uplift, but at least AMD is adding more features to somehow match the Alder Lake upgrades from Intel. The only thing missing with the new AMD chips will be PCIe 5.0. Otherwise, the V3000 lineup as well as the upcoming laptop models will finally feature support for 2x USB4 connectors, plus dual RAM slots for DDR5-4800 with ECC and 2x 32-bit sub-channels per DIMM. There are also 20 lanes of PCIe 4.0, with only 8 dedicated for the dGPU, and the integrated GPU will be based on the RDNA2 cores with up to 12 compute units. Also new here is the support for up to 2x 10 GbE NICs.
Patrick Schur mentions that the TDP range is between 15-30 W for the lower-end V3000 models with 6 cores / 12 threads, and 35-54 W for the high-end models with 8 cores / 16 threads. The guys over at Videocardz even show three V3000 SKUs with exact clocks and iGPU info, but we are not sure where they got this info from. Besides the huge potential for automotive and enterprise IoT integration, the V3000 processors with 12 CU iGPU should also make for very good upgrades in handheld gaming PCs like the the GPD Win series.
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AMD Ryzen Embedded - V3000
— Patrick Schur (@patrickschur_) June 21, 2021
Zen 3 (6 nm) - FP7r2
- up to 8 Cores / 16 Threads
- 20x PCIe 4.0 lanes (8x dGPU)
- 4x DDR5-4800 (ECC)
- two 10G ethernet PHYs
- 2x USB 4.0
- 15-30 W and 35-54 W models
- up to 12 CUs (RDNA2)