AMD first spoke about 3D V-cache stacking technology back during Computex 2021 and the first such Ryzen processor with this technology has become now a reality at CES 2022. AMD has announced the Ryzen 7 5800X3D, the first processor to leverage the new 3DFabric packaging technology developed by TSMC.
Interestingly, AMD actually showed a demo of the Ryzen 9 5900X with 3D V-cache at Computex last year but is now officially launching the technology with the 8C/16T Ryzen 7 5800X3D. The Ryzen 7 5800X3D has a base clock of 3.4 GHz and can boost up to 4.5 GHz, which is 400 MHz and 200 MHz lower than the base and boost clocks of original Ryzen 7 5800X, respectively. This could probably due to the need to accommodate the added wattage of the new 3D stack.
While the original Ryzen 7 5800X had a total of 32 MB L3 cache, the new 5800X3D offers an additional 64 MB 3D V-cache on top of this taking the total L3 cache to a total of 96 MB. The Ryzen 7 5800X3D continues to operate in the same 105 W TDP envelope and is compatible with current 400 series and 500 series motherboards. Therefore, it should be possible to overclock this chip to similar levels as the non-3D version.
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AMD Ryzen 7 5800X3D: Capable of taking on the Core i9-12900K in gaming
AMD said that the added 64 MB 3D V-cache can result in up to 15% faster gaming performance than the Ryzen 9 5900X at 1080p High depending on the title. The company also claimed similar or better performance than the Core i9-12900K Alder Lake-S processor in tested games. Of course, these claims will have to be put to the test once a review sample is made available to us.
AMD did not show any content creation numbers with the 5800X3D, so it is likely that the company is solely focusing on gamers. The 5800X3D is more of a testbed to see how well 3D stacking works in the real world, and it is possible we may see this technology become more pervasive across more Ryzen SKUs in the future.
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Zen 4 and Socket AM5 to launch in 2H 2022
Alongside the introduction of the Ryzen 7 5800X3D, AMD also showed off the 5 nm Zen 4 processor for the first time running a demo of Halo Infinite with all cores firing at 5 GHz. Zen 4 will mark the transition to a new Socket AM5, which will now be an LGA1718 part with support for PCIe Gen 5 and DDR5 memory. We also know by now that Zen 4 Raphael will integrate RDNA 2 graphics in desktop parts as well. For perspective, Intel uses an LGA1700 socket for Alder Lake-S processors.
The Zen 4 processor and the AM5 socket will have notches at the top and bottom along with the usual yellow arrow to guide the user during installation. The heat-spreader on the CPU seems to be having a unique octa-arm design as well. AMD said that the current crop of socket AM4 coolers should be fully compatible with socket AM5.
The move to an LGA socket does help in minimizing pin damage, which is a major issue with PGA CPUs such the current crop of Ryzen processors particularly for novice users. At the same time, rectifying bent pins inside an LGA socket is far more cumbersome than correcting bent ones on a PGA CPU.
The AMD Ryzen 7 5800X3D processor is slated to be available from Spring 2022. The next generation Zen 4 CPUs and Socket AM5 motherboards will be available from 2H 2022.
Source(s)
AMD CES 2022 Keynote