A possible Realme X7 Pro with the Dimensity 1000+ SoC appears on Geekbench
Realme is said to have a MediaTek Dimensity 1000+-powered phone called the X7 Pro in the works. It is rumored to have quad rear cameras and a 6.55-inch punch-hole display in addition to this high-end chipset. It may also have posted results on the Geekbench website, passing versions 4 and 5 of this benchmark.
This new leak comes in the form of listings for the "realme RMX2121" on these databases. This model number has been linked to the X3 Pro and V5 smartphones in the past. However, now that it has been detected in concert with the ARM MT6889Z/CZA (previously established as the 1000+), chipset, it may in fact be the X7 Pro instead.
It has posted scores more or less the same as (or a little better than) other known Dimensity 1000+ devices. This phone is thought to launch alongside a vanilla X7 (or, possibly, the RMX2176), on September 1, 2020 in China. It may have additional higher-end attributes such as 65 watt (W) charging, an in-display fingerprint sensor and up to 256GB of internal storage.