Category: notebook components
By: Morgan Jones
Sony develops 'world's first millimeter-wave wireless intra-connection technology'
The 11Gbps connections should pave the way for faster electronic products with smaller integrated circuitry and components
Sony has announced the development of wireless connections capable of transfer speeds of approximately 11Gbps. According to Sony, it is the first to develop 'millimeter-wave wireless intra-connection technology'. The speed and size of the connections is made possible by using electromagnetic waves with a very high frequency (30GHz to 300GHz), which consequently have a tiny wavelength (1mm to 10mm).
Very small antennas (~1mm long) are capable of emitting and receiving these high frequency radio waves over a distance of 14mm with a tiny power consumption of only 70mW. Sony has harnessed the miniaturisation potential of this hardware by developing 40nm CMOS LSI processors with integrated millimeter-wave circuits, which have an active footprint of just 0.13mm2.
Sony's pioneering move to place the technology into a single chip could have excellent long term financial implications for consumers and manufacturers alike. By using wireless connections manufacturers can reduce the amount of integrated circuits used inside electronic products, and consumers will eventually benefit from faster, more energy efficient and more reliable goods. Sony will present its technology on the 10th of February at the 2010 IEEE International Solid-State Circuits Conference held in San Francisco.
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