iPhone 16 series tipped to launch thinner thanks to upgraded PCB
The 15 Pro Max is touted as the best-designed iPhone to date, thanks to a frame that has acquired subtle inward curves along its edges as well as a switch to brushed titanium. However, it is in fact still thicker by a few milliemeters than its predecessor, as is the 15 Pro.
However, their successors might help reverse this trend, thanks to a switch to a new PCB material. Resin-coated copper foil (RCC) is rated to come with all necessary adhesive pre-applied, and, thus, might be thinner than conventional circuit-board materials.
This new rumor reinforces the growing impression that the 16 series might in fact be the USB type-C iPhones to go for, as they might have even more screen real estate, better cameras and better processors (even in the vanilla models). Who knows, they might also get those other titanium teething issues under control, too.