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iPhone 16 series tipped to launch thinner thanks to upgraded PCB

The iPhone 15 Pro. (Source: Apple)
The iPhone 15 Pro. (Source: Apple)
The iPhone 16 series could be touted as even slimmer and more elegant devices thanks to reduced frame height in this generation. It is rumored to switch to a new type of printed circuit board (PCB) material backed to be thinner than conventional alternatives, and, thus, to help next-gen devices get even skinnier in turn.

The 15 Pro Max is touted as the best-designed iPhone to date, thanks to a frame that has acquired subtle inward curves along its edges as well as a switch to brushed titanium. However, it is in fact still thicker by a few milliemeters than its predecessor, as is the 15 Pro

However, their successors might help reverse this trend, thanks to a switch to a new PCB material. Resin-coated copper foil (RCC) is rated to come with all necessary adhesive pre-applied, and, thus, might be thinner than conventional circuit-board materials.

Accordingly, it is backed to make all kinds of mobile devices, smartwatches and tablets included as well as smartphones, thinner over time.

This new rumor reinforces the growing impression that the 16 series might in fact be the USB type-C iPhones to go for, as they might have even more screen real estate, better cameras and better processors (even in the vanilla models). Who knows, they might also get those other titanium teething issues under control, too.

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> Expert Reviews and News on Laptops, Smartphones and Tech Innovations > News > News Archive > Newsarchive 2023 09 > iPhone 16 series tipped to launch thinner thanks to upgraded PCB
Deirdre O'Donnell, 2023-09-27 (Update: 2023-09-27)