Xiaomi Mi 10 Pro teardown pics and benchmarks pop up online
The Xiaomi Mi 10 Pro is among the first smartphones to be powered by the Qualcomm Snapdragon 865 SoC and it also features one of the first implementations of Samsung’s 108 MP sensor. Since the model is now available for purchase in China, the first benchmarks are already up, while Xiaomi itself went ahead and uploaded a video presenting all the different components found inside the smartphone.
Teardown videos are usually made by review sites that also test for durability, scratch resistance etc., but this time around, Xiaomi itself decided to record an elegant disassembly of its flagship, highlighting all the small but powerful components. Among the high-end chips we can see the LPDDR5 RAM chip, the UFS 3.0 storage chip, Qualcomm’s X55 5G modem and, of course, the Snapdragon 865 SoC. However, these are not as impressive as the rear camera setup that reveals just how big the 108 MP sensor is. It looks as if this sensor is as large as four telephoto sensors, plus the math sort of checks out since the chip uses 4-in-1 pixel binning that resamples final images to 27 MP.
First benchmarks for the Xiaomi Mi 10 Pro are also in, but instead of using the more popular AnTuTu app, the testers went with the Master Lu suite. Thus, the Xiaomi Mi 10 Pro managed to score 469,692 points which seems a bit on the low side if we compare it to the Snapdragon 855+-powered Nubia Red Magic 3S that is currently the record holder on Master Lu with 488,450 points. Now, we have to keep in mind that the Nubia model comes with an overclocked SoC and the test also checks for many other aspects, not just raw processing power. Also, the Master Lu suite might not actually detect the LPDDR5 RAM and USF 3.0 storage properly.
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