Upcoming Huawei Kirin PC chips rumored to feature unified architecture similar to Apple M series SoCs

Huawei is said to adopt a unified architecture for its upcoming Kirin PC chips. Compared to the traditional CPU package, the unified memory architecture puts the SoC and the DRAM on a single die. This results in higher memory bandwidth as the DRAM remains close to the SoC.

It also leads to lower power consumption as it reduces the overhead generally associated with data transfer between the separate memory pools. Another big advantage of this architecture is that it leads to better performance, thanks to the tighter integration of memory with the CPU. However, one big drawback is that the RAM is not upgradeable.

Nonetheless, Apple adopted the architecture back in 2020 with the introduction of the M series of SoCs, and the upcoming Intel Lunar Lake chips will feature it. As for Huawei adopting it for its upcoming Kirin PC chips, this info comes from a known leaker @jasonwill101 on X.

Jason didn't offer further details on it, so it's unclear how many memory tiers will be available if Huawei does decide to adopt a unified architecture. However, earlier leaks did hint that the multi-core performance would match the Apple M3 (8/256 GB 2024 MacBook Air curr. $899 on Amazon). But again, that's just another leak, and you should take these with a pinch of salt.