Samsung confirms Galaxy S26 SoC Exynos 2600 runs 30% cooler than Exynos 2500
Back in July, we reported that Samsung could use a Heat Pass Block (HPB) over the Exynos 2600 SoC to manage thermal output of the chip. The presence of the HPB on top of the chip has now been confirmed thanks to Samsung’s Kim Dae-woo, the Senior Vice President and Head of the Package Development Team.
In a talk at the ISMP 2025 event, Kim Dae-woo claimed that including an HPB on top of the SoC has allowed Samsung to bring down the heat output of the Exynos 2600 by an impressive 30% compared to the Exynos 2500. This is quite a big deal if true, as Samsung can, and will likely, use the added thermal headroom to crank the clock speeds of the Exynos 2600.
We have seen multiple preliminary benchmark runs of the Exynos 2600. Even in its pre-release state, the SoC appears to be quite impressive. For instance, in a recent benchmark, the Exynos 2600 scored more than 3,400 and 11,600 points in the Geekbench 6 single-core and multi-core benchmarks, respectively.
The emergence of promising performance also brought with it reports of Samsung using the Exynos 2600 in even the Galaxy S26 Ultra. Samsung has exclusively used a flagship Qualcomm chip inside the Galaxy S Ultra since 2023’s Galaxy S23 Ultra. So, if the rumors end up being true, Samsung is going back to a hybrid approach of using both Exynos and Qualcomm chips for all Galaxy S26 phones.
Here, we have to warn you that there are a lot of fake Exynos 2600 Geekbench scores floating around. The same could be true for other details like the camera hardware. So, take all Exynos 2600 and Galaxy S26 information you see online with a grain of salt. We won’t know for sure what Samsung is cooking until the company unveils the Galaxy S26 series at a Unpacked event.
Source(s)
ETNews, Teaser image: Samsung, Martin Martz on Unsplash, edited
