Qualcomm Snapdragon 870 5G vs Qualcomm Snapdragon 888 5G vs Qualcomm Snapdragon G3x Gen 1

Qualcomm Snapdragon 870 5G

The Qualcomm Snapdragon 870 5G Mobile Platform (SM8250-AC) is a high-end smartphone and tablet SoC that Qualcomm announced in mid 2021. The SoC integrates a fast ‘Prime Core’ that clocks up to 3.2 GHz and three additional ARM Cortex-A77 performance cores, which can reach up to 2.42 GHz. These are complemented by four power-saving ARM Cortex-A55 cores that clock up to a maximum of 1.8 GHz. Compared to the similar and older Snapdragon 865+, the Prime Core clocks 100 MHz faster and the GPU is slightly higher clocked.

Therefore, the Snapdragon 870 is slightly faster than the old Snapdragon 865 and 865 Plus and slots in behind the high end Snapdragon 888.

The Mobile Platform integrates a Qualcomm X55 5G modem with Sub-5 and mmWave support and global 5G bands with up to 7.5 GBit/s (download) speed. The SmartConnect 6800 modem supports Wi-Fi 6 with 8x8 MU-MIMU and 60 GHz 11ay up to 10 Gbps. 

The integrated GPU is still called Adreno 650 and offers a slightly higher clock speed of 670 MHz.

The on board Hexagon 698 DSP now offers a KI performance of up to 15 TOPS (up from 7 TOPS in the 855) and still uses a combination of CPU, GPU, HVX and Tensor cores. The Spectra 480 ISP is also untouched. The integrated Computer Vision Engine (CV-ISP) now supports Dolby Vision, 8K videos and 200 megapixel photos.

The built-in memory controller supports LPDDR5 with up to 2,750 MHz and LPDDR4X with 2,133 MHz.

The SoC is manufactured in the modern and power efficient 7nm process.

Qualcomm Snapdragon 888 5G

The Qualcomm Snapdragon 888 5G Mobile Platform is a high-end SoC for smartphones that was introduced in late 2020 and manufactured in 5 nm at Samsung. Integrates one “Prime Core” based on a ARM Cortex-X1 architecture clocked at up to 2.84 GHz. Three more performance cores are based on the A78 but clock up to 2.42 GHz. Furthermore, four energy saving cores are integrated that are based on the ARM Cortex-A55 architecture and clock at up to 1.8 GHz. In addition to the processor cores, the SoC integrates a WiFi 6e modem, a Hexagon 780 DSP (up to 26 TOPS of AI performance) and a Spectra 580 ISP. The integrated memory controller now supports faster LPDDR5 memory with up to 3,200 MHz. 5G is now included in the chip with the Snapdragon X60 modem.

The performance of the processor cores should be around 15% better than the old Snapdragon 865+. The integrated Adreon 660 GPU should make a bigger jump by 35% (most likely compared to the SD 865).

Qualcomm Snapdragon G3x Gen 1

The Qualcomm Snapdragon G3x Gen 1 (model number: SG8175P) is a revised version of the Snapdragon 888+ 5Gwhich is intended for use in Android-based gaming handhelds and tablets.

The SoC (system-on-a-chip) integrates a fast ARM Cortex-X1-based "Kryo 680 Prime Core" with up to 3.00 GHz and three additional fast Kryo 680 Gold performance cores (Cortex-A78-based) with up to 2.42 GHz. To save power, four additional Kyro 680 Silver (ARM Cortex-A55 based) cores have also been integrated, which operate at up to 1.8 GHz. An Adreno 660 is responsible for graphics acceleration.

The integrated Snapdragon X60 5G modem enables download speeds of up to 7.5 Gbit/s and upload speeds of up to 3 Gbit/s and supports DSS, mmWave and Sub6. The integrated FastConnect 6900 Wi-Fi modem supports all common standards, including Wi-Fi 6E with 6 GHz. Bluetooth version 5.2 is on board.

The SoC is manufactured using the 5 nm EUV process.