Qualcomm Snapdragon 845 vs Qualcomm Snapdragon 665 vs Qualcomm Snapdragon 636

Qualcomm Snapdragon 845

The Qualcomm Snapdragon 845 Mobile Platform (or SD845) is a high-end SoC for smartphones that was introduced in early 2018 and manufactured in 10 nm LPP FinFET at TSMC. Integrates 4x Kryo 385 cores (Cortex-A75) at up to 2.8 GHz (max) for performance and 4x Kryo 385 at 1.8 GHz (max) for efficiency. Furthermore offers an X20 LTE modem (Cat. 18 1.2 Gbps downlink, Cat 13 150 Mbps uplink), ac-WiFi and a dual-channel 32-Bit 1866 MHz LPDDR4x memory controller.

Qualcomm Snapdragon 665

The Qualcomm Snapdragon 665 (SM6125) is a fast mid-range ARM-based SoC largely found on Android tablets and smartphones. It features 8 Kryo 260 cores (custom design, 64-Bit capable) that are divided in two clusters. A fast cluster of four cores with up to 2 GHz (Kryo 260 Gold - Cortex-A73 derivate) and a power saving efficiency cluster with up to 1.8 GHz (Kryo 260 Silver - Cortex A53 derivate). Both clusters can also be used together.

In addition to the 8 CPU cores, the SoC integrates a mid range Adreno 610 GPU with a LPDDR4 memory controller (dual-channel)  and supports Wi-Fi (802.11ac + MIMO, max. 867 Mbps), Bluetooth 5, and LTE (X12 LTE modem with up to 600 Mbps download and 150 Mbps upload).

Power Consumption

Thanks to the new 11 nm LPP process, the energy efficiency should be quite good.

Qualcomm Snapdragon 636

The Qualcomm Snapdragon 636 (SDM636) is a mid-range octa-core SoC with eight custom Kryo 260 cores at up to 1.8 GHz, an Adreno 509 GPU, a LPDDR4-2666 memory controller (1333 MHz) and a X12 LTE (Cat 12/13, 300 Mbps down, 150 Mbps up) modem. Furthermore, the chip supports 802.11ac WiFi and Bluetooth 5.0. It is manufactured in 14nm FinFet. Qualcomm states a 40% faster performance compared to the old Snapdragon 630 (8x ARM Cortex-A53).