Qualcomm Snapdragon 695 5G vs MediaTek Dimensity 810 vs MediaTek Dimensity 6100+

Qualcomm Snapdragon 695 5G

The Qualcomm Snapdragon 695 5G (SD695) is a fast mid-range ARM-based SoC largely found on Android tablets and smartphones. It features 8 Kryo 660 called cores (64-Bit capable) that are divided in two clusters. A fast cluster of two cores with up to 2.2 GHz based on the ARM Cortex-A78 design. And a power saving efficiency cluster with up to 1.7 GHz based on much smaller ARM Cortex-A55 cores. Both clusters can also used together. The successor of the SD695 is the Snapdragon 6s Gen 3 with slightly higher clocked cores.

In addition to the 8 CPU cores, the SoC integrates a lower mid range Adreno 619 GPU, a X51 5G radio (up to 2.5 Gbits download, no mmWave), a 802.11ac (Wi-Fi 5, 8x8 sounding, Dual Band, 2x2), a Bluetooth 5.2 radio, satellite positioning (GPS, QZSS, GLONASS, SBAS, Beidou and Galileo) and a video engine (support for H.265, H.264, VP8 and VP9).

Compared to the previous SD690, the SD695 is now manufactured in 6nm (instead of 8nm) and offers a higher clocked performance cluster. However, the SD695 only supports Wi-Fi 5 instead of Wi-Fi 6 of the SD690.

MediaTek Dimensity 810

The Mediatek Dimensity 810 is a fast mid-range SoC with an integrated 5G modem. It includes two fast ARM Cortex-A76 cores at up to 2.4 GHz and six power efficient Cortex-A55 cores at up to 2 GHz (Octa-Core with Heterogeneous Multi-Processing). Furthermore, the chip integrates a 2 core ARM Mali-G57 MC2 GPU, a Wi-fi 5 modem, a LPDDR4x memory controller(up to 16 GB with 2133 MHz), a AI processing unit (APU 3.0) and video de- and encoding.

The integrated 5G modem supports dual-5G (Sub6) with up to 2.77 GBit/s download. 

The Dimensity 800 is manufactured in the modern 6nm process at TSMC and should be very power efficient.

MediaTek Dimensity 6100+

The Mediatek Dimensity 6100+ (or 6100 Plus, MT6835V/ZA) is a lower mid-range SoC with an integrated 5G modem. It includes two fast ARM Cortex-A76 cores at up to 2.2 GHz and six power efficient Cortex-A55 cores at up to 2 GHz (Octa-Core with Heterogeneous Multi-Processing). The specifications are similar to the old Dimensity 700 SoC and nearly identical to the Dimensity 6020. Compared to the 6020, the 6100+ offers slightly higher 5 G speeds (3.3 vs 2.7 Gbps), Bluetooth 5.2 (vs 5.1) support, and is manufactured in the slightly improved 6nm process (vs 7nm).

Furthermore, the chip integrates a 2 core ARM Mali-G57 MC2 GPU, a Wi-fi 5 modem, a LPDDR4x-2133 memory controller, a AI processing unit (APU 3.0) and video de- and encoding.