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Realme X9 Pro set to debut with the new MediaTek Dimensity 1200

The Realme X7 Pro. (Source: Realme)
The Realme X7 Pro. (Source: Realme)
Taiwanese chip makers MediaTek recently launched two new SoCs in the form of the Dimensity 1100 and Dimensity 1200. While neither chipset has appeared on any device yet, the latter has been slated to feature on an upcoming Realme phone—the Realme X9 Pro.
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MediaTek launched the Dimensity 1100 and Dimensity 1200 earlier this week as its flagship chipsets for the year. While no phone has been released with any of those SoCs so far, it appears Realme will lead the line in that race.

According to a report by Frandroid, Realme is set to release a new sub-premium phone, the Realme X9 Pro, shortly, and the phone will feature the just-released Dimensity 1200. Other details of the Realme X9 Pro have also been revealed. For one, the phone will sport a 6.4-inch 120 Hz FHD+ OLED. 

Supporting the Dimensity 1200 will be up to 12 GB of LPDDR5 RAM, and 128 GB or 256 GB of storage as specced. Power will be received from a 4500 mAh battery, with 65 W fast charging to keep charge times down. At the rear of the Realme X9 Pro will be a triple camera setup comprised of a 108 MP camera—likely Samsung's HM2 that was used on the Redmi Note 9 Pro 5G—and two 13 MP shooters. Launch is slated for Q1.

Buy the Realme 6 Pro on Amazon.

Source(s)

Frandroid

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> Expert Reviews and News on Laptops, Smartphones and Tech Innovations > News > News Archive > Newsarchive 2021 01 > Realme X9 Pro set to debut with the new MediaTek Dimensity 1200
Ricci Rox, 2021-01-23 (Update: 2021-01-23)