Qualcomm learning from Samsung: Snapdragon 8 Elite Gen 6 could run cooler thanks to Exynos

Samsung has seemingly achieved success with its in house Exynos 2600 chip that will power some Galaxy S26 models. That is mostly thanks to the advanced cooling technology that the company was able to implement. HPB or Heat Path Block allows the chip to run cooler buy more efficiently dissipating heat, which was one of the main concerns with the previous Exynos offering. Now, it looks like Qualcomm is taking a page out of Samsung’s playbook.

According to leaker Fixed Focus Digital on Weibo, Qualcomm is planning on using HPB thermal solution for its flagship chips that are scheduled for later this year. These include the Snapdragon 8 Elite Gen 6 and the Snapdragon 8 Elite Gen 6 Pro. The problem that Qualcomm faced with its extremely powerful Snapdragon 8 Elite Gen 5 was that it heats up quite a bit and needs a more robust cooling solution. While normal use of phones powered by the chip shows no issues, reports early on showed the devices overheating during benchmarks.

Even still, having a more efficient cooling solution will help in overall better performance and longevity. For now, information about the Snapdragon 8 Elite Gen 6 and the Snapdragon 8 Elite Gen 6 Pro is scarce, but reports have suggested that the new chips could use Samsung’s 2nm process while some variants will stick with TSMC’s 2nm process. Furthermore, one of the variants is expected to hit at least 5 GHz minimum, boosting up to 5.5 GHz. If these numbers turn out to be accurate, an HPB would be a necessity. Leaks have also indicated that the Pro version could feature a more capable GPU and support for LPDDR6 memory.

It should be noted that Qualcomm has not shared any information about the next generation of Snapdragon flagship mobile processors.