MediaTek Dimensity 8300 makes Geekbench debut with upcoming Redmi device

MediaTek is all set to unveil its current-gen mid-range offering, the Dimensity 8300, on 21 November. It comes a few days after Qualcomm unveiled its questionably-specced Snapdragon 7 Gen 3. A recent Geekbench listing has now revealed some of its SoC's key specs and how it holds up against the competition. The Dimensity 8300 sample in question is powering a Redmi K70 variant with 16 GB of RAM, which is slated to debut in "late 2023".

The Dimensity 8300 scores 1,512 and 4,886 points in Geekbench 6.2's single and multi-core tests, putting it behind Qualcomm's Snapdragon 7+ Gen 2 (found on the Poco F5, US$384 on Amazon) in single-core (1,681) but ahead in multi core (4,378). It'll be interesting to see how it fares against its successor, the Snapdragon 7 Gen 3. It is a whole lot faster than the Dimensity 8200 Ultra (1,240/3,787), indicating MediaTek has made some serious under-the-hood improvements, as confirmed by its specs.

It is spearheaded by its prime Cortex-X3 core (3.35 GHz) and complemented by 3x Cortex-A715 cores (3.20 GHz) and 4x Cortex-A510 cores (2.20 GHz). Lastly, the Dimensity 8300 uses an Arm Mali-G615 MP6 GPU. Much like many upper-mid-range SoCs launched in the past few months, it will be manufactured on TSMC's 4 nm process.