MediaTek Dimensity 7000 details revealed en route to Snapdragon 870 rivalry
MediaTek is set to launch two new chipsets for the flagship and mid-range segments. While the Dimensity 9000 is the star of the show, the Dimensity 7000 may well be the more attractive chipset, and details of the SoC's core configuration have now been revealed.
As leaked by Digital Chat Station, the MediaTek Dimensity 7000 will be built on TSMC's 5nm node, likely the same node underpinning Apple A15 Bionic. The Dimensity 7000 is tipped to feature four Cortex-A78 cores clocked at 2.75 GHz, and four Cortex-A55 cores clocked at 2.0 GHz. This promises better performance than the Dimensity 1200 which uses a similar configuration but with slightly lower-clocked cores on average. On the GPU end, the Dimensity 7000 is tipped to feature ARM's Mali-G510 MC6.
Digital Chat Station purports that the Dimensity 7000 will wage war on Qualcomm's Snapdragon 870. Considering the core configurations of the two chipsets and the fact that the lesser Dimensity 1200 already competes well with the Snapdragon 870 on the CPU end, the Dimensity 7000 is more likely to find better competition with whatever chipset Qualcomm releases as a direct successor to the Snapdragon 870.
Dimensity 7000 current sample parameters:
— Digital Chat Station (@chat_station) November 29, 2021
TSMC 5nm
4*2.75GHz A78+4*2.0GHz A55
Mali-G510 MC6 GPU
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