First rumors surface about MediaTek's upcoming Dimensity 7000 next-gen mid-range chip, 5 nm and faster than the S870

MediaTek looks to be on a roll at the moment. The company has just launched its all-new Dimensity 9000 and it has, rightly, got a lot of Android users excited by its performance potential. MediaTek doesn’t appear to be done, however, with the first leaked details of its 2022 high-performance mid-range SoC also indicating similar promise.

The new chip is expected to be called the Dimensity 7000 and will be fabricated on TSMC’s 5 nm process, which is the best in the business. While Qualcomm, AMD and others have had difficulty accessing TSMC’s nodes thanks to Apple’s tight working relationship with the company, MediaTek is a fellow Taiwanese company and that connection seems to have helped. 

Like the Dimensity 9000, the source of the leak also claims that the Dimensity 7000 will also include the latest Armv9 architecture, which is faster and more efficient. So much so that it is expected to slot between the Qualcomm Snapdragon 870 and Snapdragon 888 in terms of performance. Clearly, this is potentially game changing performance for mid-range range phones, with fast-charging support expected to reach up to 75 W speeds.

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