Earlier this year, Intel showcased its Foveros 3D stacking technology, an evolution of the processes it used to develop its Kaby Lake G processors. Foveros, Greek for awesome, will debut in Lakefield processors, which should arrive a variety of form factors including 2-in-1s by the end of next year at the latest. Tom's Hardware recently published a thorough explanation of Foveros and Lakefield during its Hot Chips 2019 coverage, so be sure to check its write-up for a technical overlook of the innovations Intel has made with its 3D stacking technology.
A Lakefield processor has now appeared on GFXBench, as spotted by @KOMACHI_ENSAKA, with a Lakefield Mobile Graphics Controller in tow. Intel has already confirmed that Lakefield processors will incorporate Intel Graphics Gen11 GPUs, which GFXBench reinforces. Intel introduced Gen11 GPUs in its Ice Lake U and U series processors, an example of which we recently reviewed in the XPS 13 7390 2-in-1, although only the base model with 32 EUs.
GFXBench details that the Lakefield Graphics Controller supports 64 EUs, making it comparable with the Iris Plus Graphics G7 found in Ice Lake G7 U and Y processors including the Core i7-1068G7. Despite being based on the same generation of GPUs, GFXBench reveals that Lakefield may not be able to match the graphics performance of Ice Lake GPUs. The Iris Plus Graphics G7 can clock up to 1,100 MHz, while GFXBench reports Lakefield reaching 500 MHz. This engineering sample could well have been downclocked to prevent GFXBench reporting its maximum potential, but this is purely speculative.
According to its presentation at Hot Chips 2019, Intel has designed Lakefield for low powered devices like 2-in-1s and those with dual-displays. Intel will manufacturer Lakefield processors on the 10 nm process that it uses for Ice Lake. However, Lakefield should have considerably lower standby power consumption than existing Intel 14 nm CPUs while delivering decent graphics performance. Essentially, Snapdragon 8cx competitors.