Hisense reveals more about new e-ink phone with magnetic secondary display

Hisense first teased the A10 back in June 2026, and recently, the company offered a first look at the e-ink phone. As revealed, it’s confirmed to feature a modular design, having support for a secondary display that magnetically attaches to the back.

The company also previously confirmed that the front will feature a 6.13-inch e-ink display, and the initial images suggested that the bezels would be quite similar to those on the recently released Hibreak Dual 2. Now, Hisense has revealed more core specs of the smartphone.

It’s confirmed to be powered by the Qualcomm QCM6690, a not-so-common SoC that’s also known as the Dragonwing Q-6690. This is the same chipset that powers the Boox Note X6, an e-ink tablet that launched in May 2026. Per Boox, this SoC can score around 690,000 on the AnTuTu benchmark, making it fall in the same tier as SoCs like the Unisoc T9100.

This choice of SoC suggests that the e-ink phone will be affordable. Hisense has further revealed that the A10 will run on Android 16, and there will be support for NFC and infrared remote control. The brand has also clarified that the magnetic portion on the back isn’t just for the detachable secondary display. It brings magnetic wireless charging support as well (Anker Prime 3-in-1 MagSafe station curr. $99.74 on Amazon).

There’s still no concrete word on when the modular e-ink phone will launch, and Hisense hasn’t shared anything on the price as well. However, per recent reports, the A10 will launch in China in August 2026.