Mediatek Helio G88 vs Qualcomm Snapdragon 665 vs Qualcomm Snapdragon 636

Mediatek Helio G88

The Mediatek Helio G88 is a mainstream ARM SoC for smartphones (mainly Android based) that was introduced in 2020. It is manufactured in a 12 nm FinFET process and integrates 8 CPU cores. Two fast ARM Cortex-A75 cores with up to 2 GHz for performance tasks and six small ARM Cortex-A55 with up to 1.8 GHz for efficiency (unverified, maybe also 2 GHz). All eight cores can be used together thanks to Heterogeneous Multi-Processing support. The integrated GPU is a ARM Mali-G52 MC2 (MP2) with two clusters at up to 1000 MHz (up from 950 MHz from the otherwise similar Helio G80). The SoC also integrates the HyperEngine that handles a dynamic management of CPU, GPU and memory. Compared to the older Helio G85, the G88 now supports 90 Hz displays and features version 2.0 of the HyperEngine.

The SoC integrates furthermore a LTE radio with Cat-7 (download) / Cat-13 (upload) support, Wifi 5 (ac), Bluetooth 5.0, LPDDR4x 1800 MHz and eMMC 5.1 storage.

Qualcomm Snapdragon 665

The Qualcomm Snapdragon 665 (SM6125) is a fast mid-range ARM-based SoC largely found on Android tablets and smartphones. It features 8 Kryo 260 cores (custom design, 64-Bit capable) that are divided in two clusters. A fast cluster of four cores with up to 2 GHz (Kryo 260 Gold - Cortex-A73 derivate) and a power saving efficiency cluster with up to 1.8 GHz (Kryo 260 Silver - Cortex A53 derivate). Both clusters can also be used together.

In addition to the 8 CPU cores, the SoC integrates a mid range Adreno 610 GPU with a LPDDR4 memory controller (dual-channel)  and supports Wi-Fi (802.11ac + MIMO, max. 867 Mbps), Bluetooth 5, and LTE (X12 LTE modem with up to 600 Mbps download and 150 Mbps upload).

Power Consumption

Thanks to the new 11 nm LPP process, the energy efficiency should be quite good.

Qualcomm Snapdragon 636

The Qualcomm Snapdragon 636 (SDM636) is a mid-range octa-core SoC with eight custom Kryo 260 cores at up to 1.8 GHz, an Adreno 509 GPU, a LPDDR4-2666 memory controller (1333 MHz) and a X12 LTE (Cat 12/13, 300 Mbps down, 150 Mbps up) modem. Furthermore, the chip supports 802.11ac WiFi and Bluetooth 5.0. It is manufactured in 14nm FinFet. Qualcomm states a 40% faster performance compared to the old Snapdragon 630 (8x ARM Cortex-A53).