Mediatek Helio G85 vs Mediatek Helio P23 MT6763T vs Mediatek Helio P90

Mediatek Helio G85

The Mediatek Helio G85 is a mainstream ARM SoC for smartphones (mainly Android based) that was introduced in 2020. It is manufactured in a 12 nm FinFET process and integrates 8 CPU cores. Two fast ARM Cortex-A75 cores with up to 2 GHz for performance tasks and six small ARM Cortex-A55 with up to 1.8 GHz for efficiency. All eight cores can be used together thanks to Heterogeneous Multi-Processing support. The integrated GPU is a ARM Mali-G52 MC2 (MP2) with two clusters at up to 1000 MHz (up from 950 MHz from the otherwise similar Helio G80). The SoC also integrates the HyperEngine that handles a dynamic management of CPU, GPU and memory.

The SoC integrates furthermore a LTE radio with Cat-7 (download) / Cat-13 (upload) support, Wifi 5 (ac), Bluetooth 5.0, LPDDR4x 1800 MHz and eMMC 5.1 storage.

Mediatek Helio P23 MT6763T

The Mediatek Helio P23 MT6763T is a mainstream ARM SoC for smartphones (mainly Android based) that was introduced in 2017. It is manufactured in a 16 nm FinFET+ process and is equipped with 8 ARM Cortex-A53 CPU cores. The cores are divided in two clusters, a performance cluster clocked at up to 2.3 GHz (2.5 GHz for a single core only) and a power efficiency cluster clocked at up to 1.65 GHz. The chip also includes an LTE modem (Cat. 7 DL / Cat. 13 UL with Dual-SIM support) and a 802.11a/b/g/n WiFi modem. The integrated ARM Mali-G71 MP2  GPU is clocked at up to 770 MHz and has two cluster (from 32). The integrated memory controller supports DDR4x (Dual-Channel?) at 1500 MHz and LPDDR3 (Single Channel only) at 933 MHz. The video engine supports H.264 de- and encoding but only decoding (playback) of H.265/HEVC.

Mediatek Helio P90

The Mediatek Helio P90 is an upper mainstream ARM SoC for smartphones (mainly Android based) that was introduced in 2019. It is manufactured in a 12 nm FinFET (12FFC) process and is equipped with 2x big ARM Cortex-A75 cores (2.2 GHz max.) and 6x small and power efficient ARM Cortex-A55 cores (2 GHz max.) in two clusters (bigLITTLE). The processor also integrates a Cat-12 (600 Mbps DL) / Cat-13 (150 Mbps UL) LTE Modem (4G), a PowerVR GM 9446 GPU, and ISP for 64 MP photos and 4K videorecording, and a AI Processing Unit with a theoretical performance of 1165 Giga-Multiply-Adds per second. The memory controller on the die supports dual-channel LPDDR4x-1866 (8 GB max.) and flash memory can be connected by UFS 2.1.

The CPU performance should be slightly below a Snapdragon 730 (e.g. in the Reno2 Z in our benchmarks) and therefore in the upper middle-class of 2019 smartphones.