Samsung Exynos 9825 vs HiSilicon Kirin 810

Samsung Exynos 9825

The Samsung Exynos 9 9825 is a mobile SoC for smartphones and tablets. It was announced in the Samsung Note 10 line in August 2019. The processor integrates three clusters of processor cores with different architectures. Two big Samsung custom M4 cores clock up to 2.73 GHz and deliver peak performance. Two additional ARM Cortex-A75 are also for performance tasks and clock at up to 2.4 GHz (up from 2.3 GHz in the 9820). Finally, four small and power efficient ARM-Cortex A55 cores clock at up to 1.9 GHz are in the third cluster. The different clusters can run simultaneously thanks to DinamIQ.

The integrated LTE modem supports LTE-Advanced Pro Cat.20 (8CA 2 Gbps download, 3CA 316 Mbps upload). The integrated graphics card is a ARM Mali G76MP12 with 12 cores. Thanks to higher clock rates, the G76 is now a bit faster compared to the Exynos 9820.

The performance of the CPU part is positioned in the high end segment for smartphone processors. Due to the slight changes in clock rates, it is very comparable to the older Eynos 9 9820. Maybe in longer load phases, the improved 7nm process helps to maintain clock speeds a bit better. The direct competitor Snapdragon 855 can be left behind in single-core benchmarks like Geekbench and operates on par in multi-core benchmarks.

The SoC is produced at Samsung in the new 7nm LPP (with EUV) process that should improve power efficiency compared to the Exynos 9820.

HiSilicon Kirin 810

The HiSilicon Kirin 810 is a ARM-based mid-range Octa-Core-SoC for Android based smartphones and tablets. It was announced mid 2019 and contains 8 processor cores. Two fast ARM Cortex-A76 cores with up to 2.27 GHz and six small power efficient ARM Cortex-A55 cores with up to 1.88 GHz (bigLITTLE). Furthermore, the SoC integrates a mid range graphics card called ARM Mali-G52 MP6 with 6 clusters. For AI acceleration, the Kirin 810 integrates a Ascend D100 Lite NPU (Da Vinci architecture). The integrates LTE modem supports Cat.12/13 with Dual Sim VoLTE. For photography, the Kirin 810 integrates the Kirin ISP4.0. The memory controller supports LPDDR4X at up to 2133 MHz. Furthermore, WiFi 802.11ac and Bluetooth 5.0 are integrated in the chip.

The SoC is manufactured in the modern 7nm process at TSMC and therefore should be very energy efficient.