Samsung Exynos 850 vs MediaTek Dimensity 700 vs MediaTek Dimensity 6100+

Samsung Exynos 850

The Samsung Exynos 850 is a System on a Chip (SoC) for entry level smartphones (Android based). It was announced in May 2020 and the first device with it is the Samsung Galaxy A21s. The chip integrates a processor with 8 small ARM Cortex-A55 cores that clock with up to 2 GHz (octa core).

The multi threaded performance is quite good thanks to 8 cores, the single threaded performance suffers a bit from the small A55 cores, although the clock rate of up to 2 GHz can help a bit.

Furthermore, the SoC integrates a LTE modem (Cat.7 2CA up to 300 MBit/s download, Cat.13 2CA 150 MBit/s upload), a Wi-fi 5 modem (802.11ac), LPPDDR4x memory controller, eMMC 5.1 flash memory controller and a video engine for FHD 60fps encoding and decoding (H.265, H.264, VP9).

It is manufactured in the modern 8nm LPP process at Samsung and should offer a good power efficiency and therefore it is also suited for small smartphones.

MediaTek Dimensity 700

The Mediatek Dimensity 700 is a fast mid-range SoC with an integrated 5G modem. It includes two fast ARM Cortex-A76 cores at up to 2.2 GHz and six power efficient Cortex-A55 cores at up to 2 GHz (Octa-Core with Heterogeneous Multi-Processing). Compared to the similar Dimensity 800U, the 700 offers lower clocked CPU cores (-200 MHz) and a slower GPU (one less core).

Furthermore, the chip integrates a 2 core ARM Mali-G57 MC2 GPU, a Wi-fi 5 modem, a LPDDR4x-2133 memory controller, a AI processing unit (APU 3.0) and video de- and encoding.

The Dimensity 700 is manufactured in the modern 7nm process and should be very power efficient.

MediaTek Dimensity 6100+

The Mediatek Dimensity 6100+ (or 6100 Plus, MT6835V/ZA) is a lower mid-range SoC with an integrated 5G modem. It includes two fast ARM Cortex-A76 cores at up to 2.2 GHz and six power efficient Cortex-A55 cores at up to 2 GHz (Octa-Core with Heterogeneous Multi-Processing). The specifications are similar to the old Dimensity 700 SoC and nearly identical to the Dimensity 6020. Compared to the 6020, the 6100+ offers slightly higher 5 G speeds (3.3 vs 2.7 Gbps), Bluetooth 5.2 (vs 5.1) support, and is manufactured in the slightly improved 6nm process (vs 7nm).

Furthermore, the chip integrates a 2 core ARM Mali-G57 MC2 GPU, a Wi-fi 5 modem, a LPDDR4x-2133 memory controller, a AI processing unit (APU 3.0) and video de- and encoding.