Qualcomm Snapdragon 625 vs HiSilicon Kirin 970 vs Qualcomm Snapdragon 615 MSM8939

Qualcomm Snapdragon 625

The Qualcomm Snapdragon 625 (SD625) is a mid-range octa-core SoC with eight ARM Cortex-A53 cpu cores at up to 2 GHz, an Adreno 506 GPU, a DDR3L-1866 memory controller and a X9 LTE (Cat 7, 4G+, 300 Mbps down, 150 Mbps up) modem. Furthermore, the chip supports 802.11ac WiFi and Bluetooth 4.1. It is manufactured in 14nm FinFet. The processor performance should be similar to a HiSilicon Kirin 650, which also offers 8 Cortex A53 cores at up to 2 GHz. However, due to the modern manufacturing process, power consumption and throttling should be better with the Snapdragon 625.

HiSilicon Kirin 970

The HiSilicon Kirin 970 is an ARM based high-end octa-core SoC for smartphones and tablet, which was introduced with the Huawei Mate 10 in late 2017. Besides 8 CPU cores (4x Cortex-A73, 4x Cortex-A53), the SoC is also equipped with a modern Mali-G72 MP12 graphics adapter, a dual-channel LPDDR4 memory controller as well as an LTE (4x4 MIMO, 5-band-carrier-aggregation, QAM-256, up to 1.2 Gbit/s) modem.

The performance cluster is clocked at up to 2.4 GHz and the four A53 power saving cores with up to 1.8 GHz. The performance should improve by about 20 percent according to Huawei and the power consumption reduced by 20 percent.

On the chip HiSilicon also included a dedicated Neural Processing Unit (NPU) for running machine learning tasks very efficiently compared to the CPU cores.

Qualcomm Snapdragon 615 MSM8939

The Qualcomm Snapdragon 615 MSM8939 is a mid-range ARMv8-based SoC largely for Android tablets and smartphones. Announced in February 2014, the S615 is one of the first 64-bit capable SoCs from Qualcomm. In addition to 8 Cortex-A53 CPU cores at up to 1.7 GHz, the SoC integrates an Adreno 405 GPU with a 2x 32-bit memory controller (LPDDR3-1600, 12.8 GB/s) and supports Wi-Fi (802.11ac), Bluetooth 4.0, UMTS, and LTE.

CPU

The Cortex-A53 is the successor to the very popular Cortex-A7 design. In addition to the new 64-bit capable ARMv8 ISA, the cores offer a variety of other improvements such as better branch prediction. This leads to a significantly higher performance per clock, which is even above the older Cortex-A9.

The eight cores of the Snapdragon 615 are divided into two quad-core clusters, each optimized for a different operating point. While one cluster can clock up to 1.7 GHz to handle more demanding applications, the other cluster is limited to a maximum of 1.0 GHz for energy-saving purposes. All eight cores can be active at the same time, although most applications aren't parallelized to support 8 cores efficiently.

Overall, the Snapdragon 615 offers a performance similar to that of the older Snapdragon 600 (Krait architecture).

GPU

Another new feature is the integrated graphics unit named Adreno 405 (550 MHz). The Adreno 400 series has been substantially redesigned and supports DirectX 11.2 (FL 11_1) including hardware tessellation, OpenGL ES 3.1, and OpenCL 1.2. Furthermore, the performance has been significantly improved, which is now similar to the Adreno 320 and PowerVR G6200.

Features

The Snapdragon 615 offers numerous wireless technologies such as Bluetooth 4.0 and WLAN 802.11a/b/g/n/ac as well as a Multi-SIM cellular modem supporting LTE cat. 4 (up to 150 Mbps), WCDMA, CDMA, EV-DO, TD-SCDMA and GSM/EDGE.

The SoC can encode and decode 1080p videos using dedicated hardware and stream content to displays with up to 2560 x 2048 pixels. A large number of video codecs including H.265 (playback only) will be supported. The camera ISP can handle sensors with up to 21 MP.

Power Consumption

The Snapdragon 615 is manufactured by TSMC in a 28 nm LP process. According to the specifications, we expect a medium or medium-high power consumption for use in medium-sized or larger smartphones and tablets.