Qualcomm Snapdragon 625 vs HiSilicon Kirin 970

Qualcomm Snapdragon 625

The Qualcomm Snapdragon 625 (SD625) is a mid-range octa-core SoC with eight ARM Cortex-A53 cpu cores at up to 2 GHz, an Adreno 506 GPU, a DDR3L-1866 memory controller and a X9 LTE (Cat 7, 4G+, 300 Mbps down, 150 Mbps up) modem. Furthermore, the chip supports 802.11ac WiFi and Bluetooth 4.1. It is manufactured in 14nm FinFet. The processor performance should be similar to a HiSilicon Kirin 650, which also offers 8 Cortex A53 cores at up to 2 GHz. However, due to the modern manufacturing process, power consumption and throttling should be better with the Snapdragon 625.

HiSilicon Kirin 970

The HiSilicon Kirin 970 is an ARM based high-end octa-core SoC for smartphones and tablet, which was introduced with the Huawei Mate 10 in late 2017. Besides 8 CPU cores (4x Cortex-A73, 4x Cortex-A53), the SoC is also equipped with a modern Mali-G72 MP12 graphics adapter, a dual-channel LPDDR4 memory controller as well as an LTE (4x4 MIMO, 5-band-carrier-aggregation, QAM-256, up to 1.2 Gbit/s) modem.

The performance cluster is clocked at up to 2.4 GHz and the four A53 power saving cores with up to 1.8 GHz. The performance should improve by about 20 percent according to Huawei and the power consumption reduced by 20 percent.

On the chip HiSilicon also included a dedicated Neural Processing Unit (NPU) for running machine learning tasks very efficiently compared to the CPU cores.