xMEMS launches XMC-2400 chip that cools electronics by moving air with sound

xMEMS has launched the XMC-2400 micro-cooling chip for dissipating heat from smartphones, tablets, and servers.

The chip leverages the company's expertise in manufacturing MEMS speakers and microphones to move air up to 39 cubic centimeters per second with just 30 mW of power consumption despite measuring a tiny 9.26 x 7.6 x 1.08 mm (0.36 x 0.30 x 0.04 in.). The sound used is ultrasonic and inaudible to humans.

MEMS (micro-electromechanical systems) devices are manufactured on a tiny scale using technology used to make CPUs. Unlike conventional fans that use spinning blades on a hub, the XMC-2400 vibrates thin piezoelectric film back and forth to move air. This is similar to how ocean waves can move boats across the ocean.

The XMC-2400 fan-on-a-chip can be mounted onto motherboards using surface-mount technology (SMT) commonly used in automated electronics manufacturing. The chip can be customized with top or side air vents and is IP58-rated for minor dust intrusion and water immersion to 1 meter (3.3 ft.). Airflow is bidirectional and minor obstructions can be pushed out with 1,000 Pa of back pressure per activation.

Readers who game on their smartphones will simply have to use magnetic phone fans (like this one on Amazon) until manufacturers add micro-cooling MEMS chips.