Intel Core i7-7560U vs AMD Ryzen 3 5400U vs Intel Celeron 3867U

Intel Core i7-7560U

The Intel Core i7-7560U is a fast dual-core SoC for notebooks and Ultrabooks based on the Kaby Lake architecture and was announced in January 2017. The CPU has two processor cores clocked at 2.4-3.8 GHz (two cores up to 3.7 GHz). The processor can execute up to four threads simultaneously thanks to Hyper Threading. It is also equipped with an Intel Iris Plus Graphics 640 GPU with 64 MB eDRAM, a dual-channel memory controller (DDR4) as well as VP9 and H.265 video decoding as well as encoding. The chip is still manufactured in a 14nm process with FinFET transistors.

Compared to the Core i7-7500U, the 7560 does have a higher single-core Turbo of 3.8 GHz (+300 MHz) and a higher dual-core Turbo (+200 MHz). The base frequency is lower (-300 MHz), but the CPU part can also use the 64 MB eDRAM as L5 cache.

Architecture

Intel basically uses the same micro architecture compared to Skylake, so the per-MHz performance does not differ. The manufacturer only reworked the Speed Shift technology for faster dynamic adjustments of voltages and clocks, and the improved 14nm process allows much higher frequencies combined with better efficiency than before.

Performance

At 2.4-3.8 GHz, the Core i7-7560U has a slightly lower frequency (except for the single-core Turbo) compared to the Core i7-7600U, but the CPU part can also use the 64 MB eDRAM, so the performance should be similar.

Graphics

The integrated Intel Iris Plus 640 Graphics is the GT3e model of the Kaby Lake GPU (Intel Gen. 9.5). It has 48 Execution Units running at 300-1050 MHz and the performance is comparable to a GeForce 920MX thanks to fast eDRAM cache. However, there aren't any significant improvements compared to the old Iris Pro 540, so modern games can often not be played smoothly or only at the lowest or medium settings, respectively.

Contrary to Skylake, Kaby lake now also supports H.265/HEVC Main 10 with a 10-bit color depth as well as Google's VP9 codec. The dual-core Kaby Lake processors announced in January should also support HDCP 2.2.

Power Consumption

The chip is manufactured in an improved 14nm process with FinFET transistors, which improves the efficiency even further. Intel still specifies the TDP with 15 Watts, which is typical for ULV chips. Depending on the usage scenario, the TDP can vary between 7.5 (cTDP Down) and 25 Watts.

AMD Ryzen 3 5400U

The AMD Ryzen 3 5400U is a processor for thin and light laptops based on the Cezanne generation. The R3 5400U integrates four of the eight cores based on the Zen 3 microarchitecture and is the slowest U-series processor of the Cezanne generation at launch. The cores are clocked at 2.6 (guaranteed base clock) to 4 GHz (Turbo) and support SMT / Hyperthreading (8 threads). The chip is manufactured in the modern 7 nm process at TSMC.

The new Zen 3 microarchitecture offers a significantly higher IPC (instructions per clock) compared to Zen 2. For desktop processors AMD claims 19 percent on average and in applications reviews showed around 12% gains at the same clock speed.

Performance

While we have not tested a single system built around the 5400U as of August 2023, we are fairly confident the chip is a little faster than the Ryzen 3 5300U and its four Zen 2 cores running at clock speeds similar to what the 5400U has. Naturally, your mileage may vary depending on how competent the cooling solution of your laptop is and how high the CPU power limits are.

In addition to the four CPU cores, the APU also integrates a Radeon RX Vega 6 integrated graphics card with 6 CUs and up to 1600 MHz. The dual channel memory controller supports DDR4-3200 and energy efficient LPDDR4-4266 RAM. Furthermore, 8 MB level 3 cache (same as the old 4800U) can be found on the chip.

Power consumption

This Ryzen 3 has a default TDP (also known as the long-term power limit) of 15 W. Laptop manufacturers are free to change that value to anything between 10 W and 25 W if so desired, with clock speeds and performance changing correspondingly. Those values aren't low enough to allow for passively cooled designs.

This is a 7 nm chip; it thus has higher-than-average, as of late 2022, energy efficiency.

Intel Celeron 3867U

The Intel Celeron 3865U is an ULV (ultra low voltage) dual-core SoC based on the Kaby-Lake architecture and has been launched in the first quarter of 2017. The CPU can be found in ultrabooks as well as normal notebooks. In addition to two CPU cores clocked at 1.8 GHz (no Turbo Boost, no HyperThreading), the chip also integrates an HD Graphics 610 GPU and a dual-channel DDR4-2133/DDR3L-1600 memory controller. The SoC is manufactured using a 14 nm process with FinFET transistors.

Compared to the similar Celeron 3865, the 3867 offers a different cTDP-down option (12.5 versus 10 Watt).

Architecture

Intel basically uses the same micro architecture compared to Skylake, so the per-MHz performance does not differ. The manufacturer only reworked the Speed Shift technology for faster dynamic adjustments of voltages and clocks, and the improved 14nm process allows much higher frequencies combined with better efficiency than before.

Performance

Due to the missing Turbo Boost and the low clock speeds, especially the single thread performance is very limited which results in a lower performance even for lower demanding tasks. The performance should be noticeably slower than the Celeron 3965 which offers 400 MHz higher clocked CPU cores. Therefore, the CPU is only suited for entry level tasks like office, web surfing and multimedia.

Graphics

The integrated graphics unit called HD Graphics 610 (similar to the HD Graphics 510) represents the "GT1" version of the Kaby Lake GPU (Intel Gen. 9). Its 12 Execution Units, also called EUs, are clocked at 300 - 900 MHz and offer a performance somewhat below the older HD Graphics 4400. Only a few games of 2015 can be played smoothly in lowest settings.

Power Consumption

Specified at a TDP of 15 W (including CPU, GPU and memory controller), the CPU is best suited for small notebooks and ultrabooks (11-inches and above). Optionally, the TDP can be lowered to 10 watts (cTDP down), reducing both heat dissipation and performance and allowing even more compact designs.