Intel Core 2 Duo T9600 vs Apple M3 Pro 12-Core vs Intel Core 2 Duo P7350
Intel Core 2 Duo T9600
► remove from comparisonThe Intel Core 2 Duo T9600 is a high end dual core CPU for laptops (at the time of introduction). Compared to the faster T9900 it does not support the new power saving C1E state. The newer Core 2 Duo P9700 offers a similar performance but features a lower TDP of 28 Watt.
Due to the high clock speed, the T9600 offers enough performance for demanding games (in 2009) and applications.
The T9600 uses a Penryn core that features 2 integer units, 1 floating point unit, 1 load unit, and 1 store unit in a 14-stages long pipeline. Due to the Wide Dynamic Execution Technology, the core is able to simultaneously execute up to four instructions.
The integrated Enhanced Speedstep is able to downclock the core dynamically (in idle mode).
The Core 2 Duo T9600 can be used in a Socket P socket with 479 pins.
Apple M3 Pro 12-Core
► remove from comparisonThe Apple M3 Pro (12 Core) is a system on a chip (SoC) from Apple for notebooks that was launched in late 2023. It integrates a new 12-core CPU with 6 performance cores with up to 4.06 GHz and 6 efficiency cores with 2.8 GHz. There is also a slimmed-down 11-core variant with a 14-core GPU.
Compared to the M2 Pro the M3 Pro has been slimmed down somewhat and swaps two performance cores for efficiency cores. This is due to the changed core configuration, as 6 cores are now used per cluster (the M2 Pro and M3 still have 4 cores per cluster). Furthermore, the memory bus has been reduced from 256 bits to 192 bits (150 GB/s vs. 200 GB/s). However, thanks to the new architecture and higher clock rates, the new M3 Pro is still slightly faster.
The M3 Pro also integrates a new graphics card with dynamic caching, mesh shading and ray tracing acceleration via hardware. In the top model, all 18 cores of the chip are used and support up to 3 displays simultaneously (internal and 2 external).
GPU and CPU can jointly access the shared memory on the package (unified memory). This is available in 18 or 36 GB variants and offers 150 GB/s maximum bandwidth (192 bit bus).
The integrated 16-core Neural Engine has also been revised and now offers 18 TOPS peak performance (compared to 15.8 TOPS in the M2 but 35 TOPS in the new A17 Pro). The video engine now also supports AV1 decoding in hardware. H.264, HEVC and ProRes (RAW) can still be decoded and encoded.
Unfortunately, the integrated WLAN only continues to support WiFi 6E (no WiFi 7), unlike the small M3 SoC thunderbolt 4 is also supported (max 40 Gbit/s).
The chip is manufactured in the current 3nm process (N3B) at TSMC and contains 37 billion transistors (-7.5% vs. Apple M2 Pro).
Intel Core 2 Duo P7350
► remove from comparisonThe Intel Core 2 Duo P7350 is a dual core processor for laptops. It features 2 GHz and a shared level 2 cache of 3 MB. It is based on the 45nm Penryn core, but Virtualization (VT-x) functions are disabled.
The P7550 uses a Penryn (Montevina Update) core that features 2 integer units, 1 floating point unit, 1 load unit, and 1 store unit in a 14-stages long pipeline. Due to the Wide Dynamic Execution Technology, the core is able to simultaneously execute up to four instructions.
The integrated Enhanced Speedstep is able to downclock the core dynamically as low as 800 MHz to save power (in idle mode).
Model | Intel Core 2 Duo T9600 | Apple M3 Pro 12-Core | Intel Core 2 Duo P7350 | ||||||||||||||||||||
Series | Intel Core 2 Duo | Apple Apple M3 | Intel Core 2 Duo | ||||||||||||||||||||
Codename | Penryn | Penryn | |||||||||||||||||||||
Series: Core 2 Duo Penryn |
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Clock | 2800 MHz | 2748 - 4056 MHz | 2000 MHz | ||||||||||||||||||||
FSB | 1066 | 1066 | |||||||||||||||||||||
L2 Cache | 6 MB | 3 MB | |||||||||||||||||||||
Cores / Threads | 2 / 2 | 12 / 12 6 x 4.1 GHz Apple M3 P-Core 6 x 2.7 GHz Apple M3 E-Core | 2 / 2 | ||||||||||||||||||||
TDP | 35 Watt | 27 Watt | 25 Watt | ||||||||||||||||||||
Transistors | 410 Million | 37000 Million | 410 Million | ||||||||||||||||||||
45 nm, 1.05-1.2125 V | 3 nm | 45 nm, 1 - 1.25 V | |||||||||||||||||||||
Die Size | 107 mm2 | 107 mm2 | |||||||||||||||||||||
max. Temp. | 105 °C | 90 °C | |||||||||||||||||||||
Socket | Socket P (BGA479, PGA478) | Socket P | |||||||||||||||||||||
Architecture | x86 | ARM | x86 | ||||||||||||||||||||
$316 U.S. | |||||||||||||||||||||||
Announced | |||||||||||||||||||||||
Manufacturer | ark.intel.com | www.apple.com | ark.intel.com | ||||||||||||||||||||
Features | ARMv8 Instruction Set | SSE4.1, Execute Disable Bit, Enhanced Speedstep, Ehnaced Halt State (C1E), 64 Bit, Trusted Execution Technology | |||||||||||||||||||||
iGPU | Apple M3 Pro 18-Core GPU | ||||||||||||||||||||||
L1 Cache | 128 KB |