UNISOC T750 vs MediaTek Dimensity 810 vs MediaTek Dimensity 820

UNISOC T750

The Unisoc T750 (Tanggula, former Spreadtrum) is a mid range SoC for Android based smartphones and tablets. It integrates an octa-core CPU with two clusters. Two fast ARM Cortex-A76 cores clocked at up to 2 GHz and six small ARM-Cortex-A55 cores at again up to 1.8 GHz for efficiency. The faster T760 SoC offers two more A76 cores, a faster GPU and a faster memory controller.

The integrated memory controller supports LPDDR4X with up to 1866 MHz. The integrated ISP supports two main cameras (up to 64 MPix). The integrated graphics card is an ARM Mali-G57 MC2 (2 cores) at up to 680 MHz. The integrated modem supports Wi-Fi 5 WLAN, 5G (TDD+FDD CA Sub-6GHz), and Cat15DL / Cat18 UL LTE.

The chip is manufactured in the modern 6nm process.

MediaTek Dimensity 810

The Mediatek Dimensity 810 is a fast mid-range SoC with an integrated 5G modem. It includes two fast ARM Cortex-A76 cores at up to 2.4 GHz and six power efficient Cortex-A55 cores at up to 2 GHz (Octa-Core with Heterogeneous Multi-Processing). Furthermore, the chip integrates a 2 core ARM Mali-G57 MC2 GPU, a Wi-fi 5 modem, a LPDDR4x memory controller(up to 16 GB with 2133 MHz), a AI processing unit (APU 3.0) and video de- and encoding.

The integrated 5G modem supports dual-5G (Sub6) with up to 2.77 GBit/s download. 

The Dimensity 800 is manufactured in the modern 6nm process at TSMC and should be very power efficient.

MediaTek Dimensity 820

The Mediatek Dimensity 820 is a fast mid-range SoC with an integrated 5G modem. It includes four fast ARM Cortex-A76 cores at up to 2.6 GHz and four power efficient Cortex-A55 cores at up to 2 GHz (Octa-Core with Heterogeneous Multi-Processing). Furthermore, the chip integrates a 5 core ARM Mali-G57 MC5 GPU, a Wi-fi 5 modem, a LPDDR4x memory controller, a AI processing unit (APU 3.0) and video de- and encoding. The Dimensity 820 is manufactured in the modern 7nm process and should be very power efficient.